Inverter module having multiple half-bridge modules for a power converter of an electric vehicle

ABSTRACT

Provided herein is a power converter component to power a drive unit of an electric vehicle drive system. The power converter component includes an inverter module formed having three half-bridge modules arranged in a triplet configuration for electric vehicle drive systems. Positive inputs, negative inputs, and output terminals of the different half-bridge inverter modules are aligned with each other. The inverter module includes a positive bus-bar coupled with the positive inputs and a negative bus-bar coupled with the negative inputs of the half-bridge inverter modules. The positive bus-bar is positioned adjacent to and parallel with the negative bus-bar. The inverter module can be coupled with a drive train unit of the electric vehicle and provide three phase voltages to the drive train unit. Each of the half bridge modules can generate a single phase voltage and three half-bridge modules arranged in a triplet configuration can provide three phase voltages.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of priority under 35 U.S.C. §120 as a continuation of U.S. patent application Ser. No. 16/051,190,filed Jul. 31, 2018 and titled “INVERTER MODULE HAVING MULTIPLEHALF-BRIDGE MODULES FOR A POWER CONVERTER OF AN ELECTRIC VEHICLE,” whichclaims the benefit of priority under 35 U.S.C. § 119(e) to U.S.Provisional Application 62/647,612, titled “INVERTER MODULE HAVINGMULTIPLE HALF-BRIDGE MODULES FOR A POWER CONVERTER OF AN ELECTRICVEHICLE”, filed on Mar. 23, 2018, each of which is incorporated hereinby reference in its entirety.

BACKGROUND

Vehicles such as automobiles have power requirements to operate thevehicle and associated or peripheral systems. The power source caninclude onboard batteries or fuel cells, gasoline or other fossil fuelor plant based fuels, as well as combinations thereof

SUMMARY

The present disclosure is directed a power converter component to powera drive unit of an electric vehicle drive system. The power convertercomponent includes an inverter module formed having three half-bridgemodules (which can also be referred to herein as a half-bridge invertermodule or a sub-module) arranged in a triplet configuration for electricvehicle drive systems. The inverter module can be coupled with a drivetrain unit of the electric vehicle and be configured to provide threephase voltages to the drive train unit. For example, each of the halfbridge modules can generate a single phase voltage and thus, the threehalf-bridge modules arranged in a triplet configuration can providethree phase voltages.

At least one aspect is directed to an inverter module. The invertermodule includes first, second and third half-bridge inverter modulescoupled with each other in a triplet configuration. The first, second,and third positive inputs of the first, second and third half-bridgeinverter modules, respectively, are aligned with each other and first,second, and third negative inputs of the first, second and thirdhalf-bridge inverter modules, respectively, are aligned with respect toeach other. The first, second, and third output terminals of the first,second and third half-bridge inverter modules, respectively, are alignedwith respect to each other. The inverter module includes a positivebus-bar coupled with the first, second, and third positive inputs of thefirst second and third half-bridge inverter modules, and a negativebus-bar coupled with the first, second, and third negative inputs of thefirst, second and third half-bridge inverter modules. The positivebus-bar is positioned adjacent to and parallel with the negativebus-bar.

At least one aspect is directed to a method including forming a first,second and third half-bridge inverter modules, coupling the first,second and third half-bridge inverter modules with each other in atriplet configuration, aligning first, second, and third positive inputsof the first, second and third half-bridge inverter modules,respectively, with each other, and aligning first, second, and thirdnegative inputs of the first, second and third half-bridge invertermodules, respectively, with each other. The method further includescoupling a positive bus-bar with the first, second, and third positiveinputs of the first second and third half-bridge inverter modules, andcoupling a negative bus-bar with the first, second, and third negativeinputs of the first, second and third half-bridge inverter modules suchthat the positive bus-bar is positioned adjacent to and parallel withthe negative bus-bar.

At least one aspect is directed to a method of providing an invertermodule. The inverter module having first, second and third half-bridgeinverter modules coupled with each other in a triplet configuration. Thefirst, second, and third positive inputs of the first, second and thirdhalf-bridge inverter modules, respectively, can be aligned with eachother. The first, second, and third negative inputs of the first, secondand third half-bridge inverter modules, respectively, can be alignedwith respect to each other. The first, second, and third outputterminals of the first, second and third half-bridge inverter modules,respectively, can be aligned with respect to each other. The invertermodule can include a positive bus-bar coupled with the first, second,and third positive inputs of the first second and third half-bridgeinverter module. The inverter module can include a negative bus-barcoupled with the first, second, and third negative inputs of the first,second and third half-bridge inverter modules. The positive bus-bar canbe positioned adjacent to and parallel with the negative bus-bar.

At least one aspect is directed to a half-bridge module. The half-bridgemodule having a cold plate, a ceramic layer disposed over a firstsurface of the cold plate, a plurality of transistors disposed withinslots of a locator, the locator and the plurality of transistorsdisposed over a first surface of the ceramic layer, and a plurality ofclips having gull wings that extend over the transistors to secure theplurality of transistors to the locator. The half-bridge module includesa first plurality of fasteners disposed through the locator and coldplate to secure the plurality of clips to the locator, a first printedcircuit board (PCB) disposed between the plurality of clips and thelocator, a capacitor disposed over a first surface of the plurality ofthe transistors, and a gel tray disposed over the capacitor, the firstPCB and the plurality of transistors.

At least one aspect is directed to a method of forming a half-bridgemodule. The method including providing a cold plate on a pick and placefixture. The cold plate having two shallow regions and a hump region,and the hump region disposed between the two shallow regions. The methodincludes dispensing a lubricant over a first surface of the cold plate,disposing a ceramic layer over the first surface of the cold plate,dispensing the lubricant over a first surface of the ceramic layer, andinstalling a locator over the first surface of the ceramic layer. Themethod includes coupling a plurality of transistors within a pluralityof slots formed in the locator using a plurality of clips and fasteners.Each of the plurality of clips including at least two gull wings thatextend out and over at least one of the plurality of transistors, andthe plurality of fasteners coupling the plurality of clips to thelocator. The method includes providing a capacitor over a first surfaceof the plurality of transistors and disposing a gel tray over thecapacitor, the hump region of the cold plate is configured to raise thecapacitor and the plurality of transistors into the gel tray.

At least one aspect is directed to a method of providing a half-bridgemodule. The half-bridge module having a cold plate, a ceramic layerdisposed over a first surface of the cold plate, and a plurality oftransistors disposed within slots of a locator. The locator and theplurality of transistors can be disposed over a first surface of theceramic layer. The half-bridge module can include a plurality of clipshaving gull wings that extend over the transistors to secure theplurality of transistors to the locator, a first plurality of fastenersdisposed through the locator and cold plate to secure the plurality ofclips to the locator, and a first printed circuit board (PCB) disposedbetween the plurality of clips and the locator. The half-bridge modulecan include a capacitor disposed over a first surface of the pluralityof the transistors, and a gel tray disposed over the capacitor, thefirst PCB and the plurality of transistors.

At least one aspect is directed to a half-bridge module. The half-bridgemodule including a cold plate having a first surface and a second,opposing surface. The cold plate includes a first region having a firstheight, a second region having the first height, and a third regionhaving a third height. The second height can be greater than the firstheight. The cold plate includes a plurality of cooling channels formedwithin the second region. One or more of the plurality of coolingchannels fluidly coupled with one or more other cooling channels. Thecold plate includes a coolant input fluidly coupled with at least onefirst cooling channel of the plurality of cooling channels, and acoolant output fluidly coupled with at least one second cooling channelof the plurality of cooling channels.

At least one aspect is directed to a method of providing a half-bridgemodule. The method includes providing a cold plate having a firstsurface and a second, opposing surface, forming a first region of thecold plate having a first height, forming a second region of the coldplate having the first height, and forming a third region of the coldplate having a third height. The second height greater than the firstheight. The method includes disposing a plurality of cooling channelswithin the second region. One or more of the plurality of coolingchannels fluidly coupled with one or more other cooling channels. Themethod includes fluidly coupling a coolant input with at least one firstcooling channel of the plurality of cooling channels, and fluidlycoupling a coolant output with at least one second cooling channel ofthe plurality of cooling channels.

At least one aspect is directed to a method of providing a half-bridgemodule. The half-bridge module having a cold plate having a firstsurface and a second, opposing surface. The cold plate includes a firstregion having a first height, a second region having the first height,and a third region having a third height. The second height can begreater than the first height. The cold plate can include a plurality ofcooling channels formed within the second region. One or more of theplurality of cooling channels fluidly coupled with one or more othercooling channels. The cold plate can include a coolant input fluidlycoupled with at least one first cooling channel of the plurality ofcooling channels and a coolant output fluidly coupled with at least onesecond cooling channel of the plurality of cooling channels.

At least one aspect is directed towards an electric vehicle. Theelectric vehicle can include an inverter module disposed in a drivetrain unit of an electric vehicle. The inverter module can includefirst, second and third half-bridge inverter modules coupled with eachother in a triplet configuration. The first, second, and third positiveinputs of the first, second and third half-bridge inverter modules,respectively, are aligned with each other and first, second, and thirdnegative inputs of the first, second and third half-bridge invertermodules, respectively, are aligned with respect to each other. Thefirst, second, and third output terminals of the first, second and thirdhalf-bridge inverter modules, respectively, are aligned with respect toeach other. The inverter module includes a positive bus-bar coupled withthe first, second, and third positive inputs of the first second andthird half-bridge inverter modules, and a negative bus-bar coupled withthe first, second, and third negative inputs of the first, second andthird half-bridge inverter modules. The positive bus-bar is positionedadjacent to and parallel with the negative bus-bar.

At least one aspect is directed towards an electric vehicle. Theelectric vehicle can include a half-bridge module disposed in a batterypack of an electric vehicle. The half bridge module can include a coldplate, a ceramic layer disposed over a first surface of the cold plate,a plurality of transistors disposed within slots of a locator, thelocator and the plurality of transistors disposed over a first surfaceof the ceramic layer, and a plurality of clips having gull wings thatextend over the transistors to secure the plurality of transistors tothe locator. The half-bridge module includes a first plurality offasteners disposed through the locator and cold plate to secure theplurality of clips to the locator, a first printed circuit board (PCB)disposed between the plurality of clips and the locator, a capacitordisposed over a first surface of the plurality of the transistors, and agel tray disposed over the capacitor, the first PCB and the plurality oftransistors.

At least one aspect is directed towards an electric vehicle. Theelectric vehicle can include a half-bridge module disposed in a drivetrain unit of an electric vehicle. The half bridge module can include acold plate having a first surface and a second, opposing surface. Thecold plate can include a first region having a first height, a secondregion having the first height, and a third region having a thirdheight. The second height greater than the first height. The cold plateincludes a plurality of cooling channels formed within the secondregion. One or more of the plurality of cooling channels fluidly coupledwith one or more other cooling channels. The cold plate includes acoolant input fluidly coupled with at least one first cooling channel ofthe plurality of cooling channels, and a coolant output fluidly coupledwith at least one second cooling channel of the plurality of coolingchannels.

These and other aspects and implementations are discussed in detailbelow. The foregoing information and the following detailed descriptioninclude illustrative examples of various aspects and implementations,and provide an overview or framework for understanding the nature andcharacter of the claimed aspects and implementations. The drawingsprovide illustration and a further understanding of the various aspectsand implementations, and are incorporated in and constitute a part ofthis specification.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are not intended to be drawn to scale. Likereference numbers and designations in the various drawings indicate likeelements. For purposes of clarity, not every component may be labeled inevery drawing. In the drawings:

FIG. 1 depicts an example schematic of a half-bridge inverter circuit ofa half-bridge module having a capacitor coupled with at least twotransistors;

FIG. 2 depicts an example transistor (TO-247) used in a half-bridgemodule, according to an illustrative implementation;

FIG. 3 depicts an example cross-sectional top view of an inverter modulehaving three half-bridge modules, according to an illustrativeimplementation;

FIG. 4 depicts an example cross-sectional side view of an invertermodule having three half-bridge modules, according to an illustrativeimplementation;

FIG. 5 depicts an example cross-sectional front view of an invertermodule having three half-bridge modules, according to an illustrativeimplementation;

FIG. 6 depicts an example isometric view of an inverter module having ahousing and a high-voltage connector coupled with at least one side ofthe inverter module, according to an illustrative implementation;

FIG. 7 depicts an example isometric view of the inverter module havingat least one surface removed to expose three half-bridge modulesdisposed within the inverter module, according to an illustrativeimplementation;

FIG. 8 depicts an example isometric view of an inverter module having atriplet half-bridge module arrangement, with each of the half-bridgemodules coupled having an output terminal coupled with a phase bus-bar,according to an illustrative implementation;

FIG. 9 depicts an example isometric view of the inverter module of FIG.8 rotated to illustrate the coupling between the inputs of the first,second and third half-bridge modules and the positive and negativebus-bars, according to an illustrative implementation;

FIG. 10 depicts an example isometric view of the inverter module of FIG.8 rotated to illustrate the coupling between the first, second and thirdhalf-bridge modules and a printed circuit board coupled with one surfaceof each of the first, second and third half-bridge modules, according toan illustrative implementation;

FIG. 11 depicts an example top view of a gel tray to be disposed overdifferent components of a half-bridge module, according to anillustrative implementation;

FIG. 12 depicts an example bottom view of a gel tray to be disposed overdifferent components of a half-bridge module, according to anillustrative implementation;

FIG. 13 depicts an example isometric view of a half-bridge moduleillustrating the positive and negative inputs, thermal pad and coldplate interface, according to an illustrative implementation;

FIG. 14 depicts an example isometric view of the half-bridge module ofFIG. 13 rotated to show a phase output terminal, thermal pad and coldplate interface, according to an illustrative implementation;

FIG. 15 depicts an example isometric view of the half-bridge module ofFIG. 13 rotated to show a cold plate coupled with a gel tray, accordingto an illustrative implementation;

FIG. 16 depicts an example cross-sectional views of a section of ahalf-bridge module to illustrate the spatial arrangement of thedifferent components of the half-bridge module, according to anillustrative implementation;

FIG. 17 depicts an example exploded view of a section of a half-bridgemodule to illustrate the interface between the clips, transistors, PCB,locator, ceramic layer and cold plate, according to an illustrativeimplementation;

FIG. 18 depicts an example sectional view of a half-bridge modulecircuit formed within a half-bridge module using the lead frame of acapacitor as a bus-bar, according to an illustrative implementation;

FIG. 19 depicts an example cut-away view of a half-bridge module toillustrate the different components and layers of the half-layer bridgemodule with respect to each other, according to an illustrativeimplementation;

FIG. 20 depicts an example exploded view of a section of a half-bridgemodule to illustrate the interface between the clips, transistors, PCB,locator, ceramic layer and cold plate, according to an illustrativeimplementation;

FIG. 21 depicts an example exploded view of a section of a half-bridgemodule to illustrate the interface ends of the gel tray, capacitorconductors, the thermal pad, and cold plate, according to anillustrative implementation;

FIG. 22 depicts an example view of a plurality of transistors coupledwith a locator through a plurality of clips, with each of the clipshaving gull wing portions to hold the transistors in place within thelocator, according to an illustrative implementation;

FIG. 23 depicts an example view of a thermal interface of a half-bridgemodule showing the spatial relationship between a cold plate, ceramiclayer, locator and transistors, according to an illustrativeimplementation;

FIG. 24 depicts an example locator having a plurality of slots to couplewith different components of a half-bridge module, according to anillustrative implementation;

FIG. 25 depicts an example bottom view of a cold plate showing at leasttwo cooling ports to receive or release coolant, according to anillustrative implementation;

FIG. 26 depicts an example top view of a cold plate, according to anillustrative implementation;

FIG. 27 depicts an example side view of a cold plate having at least twoshallow regions and a hump region, according to an illustrativeimplementation;

FIG. 28 depicts an example cut-away view to show a plurality of coolingchannels formed within a cold plate, according to an illustrativeimplementation;

FIG. 29 depicts example transistor having straight leads that arecoupled with a printed circuit board, according to an illustrativeimplementation;

FIG. 30 depicts an example transistor having bent leads, according to anillustrative implementation;

FIG. 31 depicts an exploded view of a half-bridge inverter module,according to an illustrative implementation;

FIGS. 32-33 depict a flow diagram of a method of assembling andmanufacturing an inverter module having three half-bridge modules,according to an illustrative implementation;

FIGS. 34-40 depict a flow diagram of a method of assembling andmanufacturing a half-bridge module, according to an illustrativeimplementation;

FIG. 41 depicts a flow diagram of a method of assembling andmanufacturing an inverter module having three half-bridge modules,according to an illustrative implementation;

FIG. 42 depicts a flow diagram of a method of wiring and harnesses aninverter module, according to an illustrative implementation;

FIG. 43 depicts a flow diagram of a method of forming an invertermodule, according to an illustrative implementation;

FIGS. 44-45 depict a flow diagram of a method of forming a half-bridgemodule, according to an illustrative implementation;

FIG. 46 is a block diagram depicting a cross-sectional view of anexample electric vehicle installed with a battery pack;

FIG. 47 depicts a flow diagram of a method of forming a half-bridgemodule, according to an illustrative implementation;

FIG. 48 provides a method of providing an inverter module; and

FIG. 49 provides a method of providing a half-bridge module.

Following below are more detailed descriptions of various conceptsrelated to, and implementations of, methods, apparatuses, and systems ofproviding inverter/capacitor packages for electric vehicle. The variousconcepts introduced above and discussed in greater detail below may beimplemented in any of numerous ways, as the described concepts are notlimited to any particular manner of implementation.

DETAILED DESCRIPTION

Systems and methods described herein relate to an inverter module formedhaving three half-bridge modules (which can also be referred to hereinas a half-bridge inverter module or sub-module) arranged in a tripletconfiguration for electric vehicle drive systems. The inverter modulecan be coupled with a drive train unit of an electric vehicle and beconfigured to provide three phase voltages to the drive train unit. Forexample, each of the half bridge modules can generate a single phasevoltage and thus, the three half-bridge modules arranged in a tripletconfiguration can provide three phase voltages.

During development and manufacturing of a half-bridge module,technological or physical compromises with respect to the differentcomponents of the half-bridge module can be made to meet one or moreneeds or requirements of a particular electrical drive system. Forexample, compromises can be made between cost, engineering flexibility,manufacturing, packaging design, thermal design or electrical design ofone or more components of the respective half-bridge module. Thesecompromises may result in undesirable design changes that can impact aperformance of the half-bridge module. The half-bridge modules describedherein can alleviate the issues associated with these compromises andprovide a half-bridge module having a half-bridge inverter based onTO-247 transistors, a cold plate, and sensing/control electronichardware. Thus, the half-bridge modules described herein can strike abalance between high performance (e.g., low electrical parasitics, highcurrent capacity, low component temperatures), high power density, lowvolume, low cost and having properties that allow them to be compatiblefor mass production.

The half-bridge modules described herein can be formed and arrangedwithin an inverter module in a triplet configuration to provide acompact design. For example, a half-bridge module can be formed having alength of about 220 mm to about 230 mm, a width of about 80 mm to about90 mm and a height of about 60 mm to about 70 mm. The dimensions andsize of the half-bridge modules described herein can vary outside theseranges. The half-bridge modules can be positioned such that theirrespective input terminals and output terminals are aligned. Thealignment of the input terminals and output terminals can allow one ormore bus-bars coupled with each of the half-bridge modules to bedisposed adjacent and parallel to each other.

FIG. 1 shows a half-bridge inverter circuit 100 having at least onepositive terminal 105 (which can also be referred to herein as apositive input, positive input terminal), at least one negative terminal110 (which can also be referred to herein as a negative input, negativeinput terminal) forming a loop. The half-bridge inverter circuitincludes at least one capacitor 115 coupled between the positiveterminal 105 and the negative terminal 110. The half-bridge invertercircuit 100 includes a first transistor 120 and a second terminal 120coupled between the positive terminal 105, the negative terminal 110 anda phase terminal 130. The first transistor 120 includes a base terminal,a collector terminal, and an emitter terminal. The collector terminalcan couple with the positive terminal 105. The emitter terminal cancouple with a phase terminal 130 and a collector terminal of the secondtransistor 120. The second transistor 120 includes a base terminal, acollector terminal, and an emitter terminal. The emitter terminal of thesecond transistor 120 can couple with the negative terminal 110. Thefirst transistor 120 and the second transistor 120 can be configured tooperate as switches and provide a phase voltage through the phaseterminal 130, for example, to a three phase motor or motor drive unit ofan electrical vehicle.

The half-bridge inverter circuit 100 provides a closed inductance loopbetween the capacitor 115 (e.g., a DCLSP capacitor) and first and secondtransistors 120 (e.g., TO-247 transistors, switches), where thecapacitor 115 lead frame can make electrical connections directly to thefirst and second transistors 120. The leads of the first and secondtransistors 120 can be unbent, and terminated to or otherwise coupledwith the capacitor 115 through resistive welding. Thus, the lead lengthof the first and second transistors 120 before the weld termination canbe minimized. For example, the straight and unbent leads of first andsecond transistors 120 that can be short in length theoreticallyminimizes parasitic inductance effects, relative to alternative designswhere more of the transistor lead is utilized or the leads are bent toreach their target connections.

The half-bridge circuit 100 can be formed such that a distance betweenfirst and second transistors 120 (e.g., IGBT semiconductor die) and thecapacitor 115 (e.g., filtering capacitor film elements) is minimized.For example, by coupling the lead frame of the capacitor 115 with thelead frame of the first and second transistors 120, the inductance looppresent in the half-bridge circuit 100 can have a reduced size. The leadframe of the capacitor 115 can couple directly with the lead frame ofthe first transistor 120 or the second transistor 120 such that adistance between them is zero. A distance between a lead or fingerportion of the lead frame of the capacitor 115 and a body portion of thefirst transistor 120 or the second transistor 120 can be in a range from5 mm to 20 mm. The distance between a lead or finger portion of the leadframe of the capacitor 115 and a body portion of the first transistor120 or the second transistor 120 can be in a range from 0 mm (e.g., incontact) to 15 mm. For example, a physical distance between a lead orfinger portion of the lead frame of the capacitor 115 and a body portionof the first transistor 120 or the second transistor 120 can be in arange from 0 mm to 5 mm. A distance an electrical signal may travelbetween a lead or finger portion of the lead frame of the capacitor 115and a body portion of the first transistor 120 or the second transistor120 can be in a range from 10 mm to 15 mm.

This arrangement of capacitor elements and conductors minimizes distanceand maintains equidistance between the capacitor elements and transistordies, on both the high side and low side. Electrical loss is in thisexample minimal and uniform across all insulated gate bipolartransistors (IGBTs). The capacitor and the previously intermediatebus-bars can be one homogenous part, sharing structure, insulation,mounting points, and heat dissipation surfaces. The mechanical tolerancestack-up between the X capacitor and laminated bus-bar can beeliminated. The capacitor case can provide the bus-bars with thestructural backing or support needed to compress thermal pads againstheat dissipation surfaces in a single assembly step, in contrast with atechnique that uses separate plastic brackets/clips to this fulfill thisroll. Part count is thus further reduced in the context of the assembly.Further, cost is reduced for purchased component as well as in-houseassembly/labor. This assembly also accomplishes weight reduction. Forexample, approximately 30% less copper can be used when the capacitorand laminated bus-bar are combined. Several fasteners and layers ofinsulation film can also be eliminated. The capacitor 115 can includeDC-Link, Single-Phase Capacitors (“DCLSP Capacitors”) used as Xcapacitors/DC-Link filtering capacitors orautomotive/industrial/commercial inverters. The bus-bars in thecapacitor can serve as the conducting paths indicated in FIG. 1.

FIG. 2 shows a front and a back view of the transistor 120. Thetransistor 120 may include a TO-247 transistor or a TO-247 discreet IGBTpackage. The transistors can include a variety of different transistors.The transistor 120 can include a semiconductor device having one or moreconnections. For example, and as depicted in FIG. 1, the transistor 120can include a base terminal, a collector terminal, and an emitterterminal. Each of the transistors 120 can include one or more leads 205.For example, each of the transistors 120 may include three leads 205.Each of the three leads 205 can corresponds to at least one of theterminals of the transistor 120. For example, a first lead 205 cancorrespond to the base terminal or base lead. A second lead 205 cancorrespond to the collector terminal or collector lead. A third lead 205can correspond to the emitter terminal or emitter lead. The leads 205can receive or provide a voltage signal or a current signal. Thetransistor 120 can be incorporated into the half-bridge modulesdescribed herein.

FIGS. 3-5 show cross-sectional views of an inverter module 300 havingthree half-bridge modules 305. In FIG. 3, a top view of first, second,and third half-bridge modules 305 disposed in a triplet configurationwithin an enclosure 310 of the inverter module 300 is provided. Thefirst, second, and third half-bridge modules 305 are disposed adjacentwith respect to each other. For example, the half-bridge modules 305 canbe positioned such that a second side surface 315 of the firsthalf-bridge module 305 is adjacent to a first side surface 315 of thesecond half-bridge module 305 and a second side surface 315 of thesecond half-bridge module 305 is adjacent to a first side surface 315 ofthe third half-bridge module 305. The half-bridge modules 305 can bedisposed in other arrangements within the inverter module 300. Thehalf-bridge modules 305 can be disposed in a triplet configuration toprovide a compact size of the inverter module 300. The first, second,and third half-bridge modules 305 can be formed having a length rangingfrom 200 mm to 240 mm, a width ranging from 70 mm to 100 mm, and aheight ranging from 50 mm to 80 mm. The dimensions and size of thehalf-bridge modules 305 described herein can vary outside these ranges.

The half-bridge modules 305 can be formed in a variety of differentshapes. For example, and as depicted in FIG. 3, the half-bridge modulescan have rectangular shapes. The half-bridge modules 305 can be formedto be modular units having similar shapes, sizes, and dimensions suchthat they can interchangeable within an inverter module 300. Thus,individual half-bridge modules 305 can be replaced, serviced orotherwise repaired without replacing an entire inverter module 300. Eachof the half-bridge modules 305 in a common inverter module 300 may havethe same shape, size, and dimensions or one or more of the half-bridgemodules 305 in a common inverter module 300 may have a different shape,size, or dimensions. The half-bridge modules 305 can be formed to bemodular units having similar shapes, sizes, and dimensions such thatthey can interchangeable within an inverter module 300.

FIG. 4 provides a side view of the inverter module 300 showing across-sectional view of one of the half-bridge modules 305. Thehalf-bridge module 305 includes a power printed circuit board (PCB) 420,a control PCB 425, and an electromagnetic interference (EMI) shield 430disposed between the power PCB 420 and the control PCB 425. The powerPCB 420 can be configured to provide power to the half-bridge modules305 forming the inverter module 300. For example, each of thehalf-bridge modules 305 may include a power PCB 420. Thus, the invertermodule 300 can include multiple power PCBs 420 with each power PCB 420configured to provide power signals to at least one of the respectivehalf-bridge modules 305 to power the respective half-bridge modules 305.The control PCB 425 can provide control signals to the half-bridgemodules 305 forming the inverter module 300 to control operation of thehalf-bridge modules 305. For example, the control PCB 425 can use thecontrol signals to activate (e.g., turn-on) or deactivate (e.g.,turn-off) one or more of the half-bridge modules 305. The EMI shield 430can be disposed between the control PCB 425 and each of the power PCBs425 to electrically isolate the control PCB 425 from the power PCBs 425.

The inverter module 300 includes an inlet coolant manifold 435, anoutlet coolant manifold 440 and a coolant temperature sensor 445disposed adjacent to, proximate to, or within a predetermined distancefrom the outlet coolant manifold 440. The inlet coolant manifold 435 caninclude an orifice or hole configured to receive coolant fluid andprovide the coolant fluid to the inverter module 300 to provide coolingfor the half-bridge modules 305 disposed within the inverter module. Thecoolant temperature sensor 445 can be posited to measure a temperatureof the coolant fluid as it is released or removed from the invertermodule 300. The inverter module 300 may include a coolant temperaturesensor 445 disposed adjacent to, proximate to, or within a predetermineddistance from the inlet coolant manifold 435 to measure a temperature ofcoolant fluid provided to the inverter module 300.

The inlet coolant manifold 435 and the outlet coolant manifold 440 canbe fluidly coupled such that coolant fluid provided to the inlet coolantmanifold 435 can flow through the inverter module 300 to provide coolingto the components of the half-bridge modules 305 forming the invertermodule 300 and exit the inverter module 300 through the outlet coolantmanifold 440. For example, a tube, conduit, or hollow layer can couplethe inlet coolant manifold 435 to the outlet coolant manifold 440 andthe tube, conduit or hollow layer can run or extend through a length ofthe inverter module 300 such that it is positioned next to, adjacent to,or proximate to portion of one or more half-bridge modules 305 formingthe inverter module 300 to provide cooling to the components of thehalf-bridge modules 305. The hollow layer may include a wall structureof the inverter module 300 formed having a hollow inner portion toreceive coolant fluid.

The inverter module 300 includes a positive bus-bar 455, a negativebus-bar 460 and a phase bus-bar 465. The positive bus-bar 455 and thenegative bus-bar 460 can be positioned adjacent to and parallel withrespect to each other. For example, the positive bus-bar 455 can bedisposed at a first level or height along a first side of thehalf-bridge modules 305 and the negative bus-bar 460 can be disposed ata second, different level or height along the first side of thehalf-bridge modules 305. The positive bus-bar 455 and the negativebus-bar 460 can be disposed along a first side of the half-bridgemodules 305 and the phase bus-bar 465 can be disposed along a second,different side of the half-bridge modules 305. Positioning the positivebus-bar 455 and the negative bus-bar 460 at different heights providesspacing for the positive bus-bar 455 and negative bus-bar 460 to bedisposed along the same side of the half-bridge module 305. Thus,multiple half-bridge modules 305 can couple with the same the positivebus-bar 455 and negative bus-bar 460 and be aligned with respect to eachother.

The half-bridge modules 305 can be positioned such that their respectiveinput terminals and output terminals are aligned. For example, each ofthe half-bridges modules 305 can include a positive input coupled withthe positive bus-bar 455 along a first side of the half-bridge modules305 and a negative input coupled with the negative bus-bar 460 along thefirst side of the half-bridge modules 305. Each of the half-bridgemodules 305 can include an output terminal coupled with the phasebus-bar 465 along a second, different side of the half-bridge modules.The alignment of the input terminals and output terminals can allow oneor more bus-bars coupled with each of the half-bridge modules to bedisposed adjacent and parallel to each other. An enclosure lid 440 canbe disposed over each the half-bridge modules 305 disposed within theenclosure 310 of the inverter module 300. For example, the enclosure lid440 can seal the enclosure 310 and be configured to protect thehalf-bridge modules 305 from an environment the inverter module 300 andthe half-bridge modules 305 forming the inverter module 305 aredisposed.

FIG. 5 provides a front view of the inverter module 300 showing across-sectional view of one of the first, second, and third half-bridgemodules 305 disposed adjacent to each other in a triplet configuration.For example, the half bridge modules are disposed side by side with thesecond half-bridge module 305 disposed between the first half-bridgemodule 305 and the third half-bridge module 305. The half-bridge modules305 can be aligned with respect to each other such that a top surface ofeach of the first, second, and third half-bridge modules 305 are alignedwith respect to each other and a bottom surface of each of the first,second, and third half-bridge modules 305 are aligned with respect toeach other. The side surfaces of the first, second, and thirdhalf-bridge modules 305 can be aligned with respect to each other toform the triplet configuration.

As depicted in FIG. 5, the first, second, and third half-bridge modules305 are disposed within the enclosure 310 (e.g., housing) of theinverter module 300. The enclosure 310 includes the enclosure lid 450 toseal or close the enclosure such that the half-bridge modules 305 areprotected from an environment around the inverter module 300. Theenclosure 310 includes a gearbox mounting flange 570 extending from aside surface of the enclosure 310. For example, the gearbox mountingflange 570 can be formed such that it is perpendicular to the sidesurface of the enclosure 310. The gearbox mounting flange 570 can beconfigured to mount or position the inverter module 300 in a drive trainunit of an electric vehicle.

The spatial relationship between the power PCB 420, the EMI shield 430and the control PCB 425 is depicted in FIG. 5. For example, the powerPCB 420 is disposed at a first distance from a surface (e.g., topsurface, bottom surface) of the first, second, and third half-bridgemodules 305. The EMI shield 430 is disposed at a second distance from asurface (e.g., top surface, bottom surface) of the first, second, andthird half-bridge modules 305. The control PCB 425 is disposed at athird distance from a surface (e.g., top surface, bottom surface) of thefirst, second, and third half-bridge modules 305. The first distance canbe less than the second and third distances. The second distance can beless than the third distance. The power PCB 420 can be disposed asmaller distance (e.g., closer) from the first, second, and thirdhalf-bridge modules 305 than the control PCB 425 and the EMI shield 430.The control PCB 425 can be disposed a greater distance from the first,second, and third half-bridge modules 305 than the power PCB 420 and theEMI shield 430. Although FIGS. 3-5 illustrate three half-bridge modules305 disposed within the inverter module 300, the inverter module 300 caninclude less than three half-bridge modules 305 or more than threehalf-bridge modules 305.

FIG. 6 shows a top view of the enclosure 310 of the inverter module 300.The enclosure 310 can be formed from a variety of different materialincluding, but not limited to, plastic material. The enclosure 310includes the enclosure lid 450 (or cover), a high-voltage (HV) connector605 (e.g., DC connection) formed on or otherwise coupled with a firstside surface of the enclosure 310 and a low-voltage (LV) connector 615formed on a second, different side surface (e.g., opposite end) of theenclosure 310. The enclosure lid 450 can be coupled with the enclosurethrough a plurality of fasteners 630 (e.g., screws, bolts). The HVconnector 605 can be configured to couple with a high voltage powersource to provide power in a first voltage range (e.g., high voltagerange) to the inverter module 300. The LV connector 615 can beconfigured to couple with a low voltage power source to provide power ina second voltage range (e.g., low voltage range) to the inverter module300.

The enclosure 310 includes a coolant input hose connection 620 (e.g.,coolant input hose bard) than can receive a hose, tube, or conduit suchthat coolant can be provided to the enclosure 310 through the coolantinput hose connection 620. For example, the coolant input hoseconnection 620 can include an orifice, a hole, or a threaded hole toreceive or couple with a hose, tube or conduit. The enclosure 310includes a mounting flange 625. The mounting flange 625 can be formed toaid in coupling the enclosure 310 within a drive train unit of anelectric vehicle. The enclosure 310 can include a single mounting flange625 or multiple mounting flanges 625. For example, the enclosure 310 mayinclude a mounting flange 625 formed on each side or end surface of theenclosure 310.

FIG. 7 illustrates the inverter module 300 having three half-bridgemodules 305 disposed within the enclosure 310 (e.g., housing) of theinverter module 300. In FIG. 7, the enclosure lid is removed to show thearrangement of the first, second and third half-bridge modules 305 (orsub-modules) disposed within the inverter module 300 in a tripletconfiguration. The first, second and third half-bridge modules 305 arecoupled with a positive bus-bar 455, a negative bus-bar 460 (as shown inFIG. 4), and first, second and third phase bus-bars 465 (e.g., outputterminals). The positive bus-bar 455 can be disposed parallel to thenegative bus-bar 460 such that the positive and negative bus-bars couplewith positive input terminals and negative input terminals, respectivelyof each of the first, second and third half-bridge modules 305. Each ofthe first, second and third half-bridge modules 305 may include anoutput terminal coupled with at least one of the first, second and thirdphase bus-bars 465. For example, the first half-bridge module 305 caninclude a first output terminal coupled with a first phase bus-bar 465,the second half-bridge module 305 can include a second output terminalcoupled with a second bus-bar 465, and the third half-bridge module 305can include a third output terminal coupled with a third phase bus-bar465.

The enclosure 310 includes a DC connector 705. The DC connector 75 cancorrespond to a high voltage connector and be configured to receive avoltage (e.g., DC voltage) to provide power to the inverter module 300and to the first, second, and third half-bridge modules 305 forming theinverter module 300. A coolant input 735 can be formed on a first sidesurface of the enclosure 310 and a coolant output 740 can be formed on asecond side surface of the enclosure 310. The coolant input 735 caninclude an input hose barb and be configured to receive or couple with ahose, tube, or conduit to receive coolant and provide the coolant to theinverter module 300. The coolant output 740 can include an output hosebarb and be configured to receive or couple with a hose, tube, orconduit to release coolant from the inverter module 300.

The coolant input 735 can be coupled with a coolant inlet manifold 435of the inverter module 300 and the coolant output 740 can be coupledwith a coolant outlet manifold 440 of the inverter module 300. Thecoolant input 735 and the coolant output 740 can be formed on the samesurface of the enclosure or the coolant input 735 and the coolant output740 can be formed on different surfaces of the enclosure 310. Theenclosure 310 includes a vent 710 to vent the inverter module 300 andthe first, second, and third half-bridge modules 305 forming theinverter module 300. The vent 710 can include or be formed as a hole oropening in a side surface of the enclosure 310. For example, the vent710 can provide air to an inner region of the enclosure 310 to providecooling to the first, second, and third half-bridge modules 305 formingthe inverter module 300. The enclosure 710 includes a gearbox harness715 and a gearbox mounting flange 720. The harness 715 can be configuredto couple one or more of the first, second, and third half-bridgemodules 305 with different power systems of a drive train unit. Forexample, the gearbox harness 715 can electrically couple the half-bridgemodule 305 or the inverter module 300 with different power systems of adrive train unit to convey or transmit electrical signals between thehalf-bridge module 305 or the inverter module 300 and the power systemsof the drive train unit. The mounting flange 720 can be formed along oneor more surfaces or edges of the enclosure 310 to aid in coupling theinverter module 300 within a drive train unit of an electric vehicle.

As depicted in FIG. 7, the enclosure 310 can be formed having arectangular shape. However, the enclosure 310 can be formed in a varietyof different shapes or having different dimensions. The particular shapeor dimensions of the enclosure 310 can be selected based at least inpart on the shape and dimensions of the half-bridge modules 305 or theshape and dimensions of a space within a drive train unit of an electricvehicle that the enclosure 310 is to be disposed within. The enclosure310 can have a length in a range from 270 mm to 290 mm (e.g., 280 mm).The enclosure 310 can have a width in a range from 280 mm to 300 mm(e.g., 290 mm). The enclosure 310 can have a height in a range from 120mm to 132 mm (e.g., 127 mm).

FIG. 8 illustrates the first, second and third half-bridge modules 305coupled with the positive bus-bar 455 and the negative bus-bar 460. Thepositive bus-bar 455 and the negative bus-bar 460 can be formed ordisposed along a common side surface of the first, second, and thirdhalf-bridge modules 305 to reduce the dimensions of the inverter module300 and provide a compact design. As depicted in FIG. 8, the positivebus-bar 455 is positioned along first sides 810 of the first, second,and third half-bridge modules 305 at a first level or height and thenegative bus-bar 460 is positioned along first sides 810 of the first,second, and third half-bridge modules 305 at a second level or height(e.g., different from the first level or height). For example, thepositive bus-bar 455 is positioned parallel to and adjacent to thenegative bus-bar 460 along the first sides 810. The positive bus-bar 455can be positioned parallel to and above the negative bus-bar 460 alongthe first sides 810 or the positive bus-bar 455 can be positionedparallel to and below the negative bus-bar 460 along the first sides810.

The first, second and third half-bridge modules 305 include an outputterminals 805 formed on second side surfaces 820 of the half-bridgemodules 305. The second side surfaces 820 can correspond to an oppositeside or opposite end of the half-bridge modules 305 as compared with thefirst side surfaces 810. For example, the first half-bridge module 305includes a first output terminal 805 formed on the second side surface820 of the first half-bridge module 305. The second first half-bridgemodule 305 includes a second output terminal 805 formed on the secondside surface 820 of the second half-bridge module 305. The thirdhalf-bridge module 305 includes a third output terminal 805 formed onthe second side surface 820 of the third half-bridge module 305.

The output terminals 805 of the first, second, and third half-bridgemodules 305 can be aligned with respect to each other. For example, theoutput terminals 805 can be formed at a same height or level along thesecond side surfaces 820 of the first, second, and third half-bridgemodules 305. The output terminals 805 of the first, second, and thirdhalf-bridge modules 305 can couple with phase bus-bars 465 to provide anoutput from the half-bridge modules 305. The first output terminal 805of the first half-bridge module 305 can couple with a first phasebus-bar 465, the second output terminal 805 of the second half-bridgemodule 305 can couple with a second phase bus-bar 465, and the thirdoutput terminal 805 of the third half-bridge module 305 can couple witha third phase bus-bar 465.

The first, second, and third phase bus-bars 465 extending from thefirst, second, and third half-bridge inverter modules 305 can be formedor disposed along the second side surfaces 820 such that they arealigned or parallel with respect to each other. The first, second, andthird phase bus-bars 465 can include first, second, and third phaseoutputs 825, respectively, that are formed or disposed at a common orsame level with respect to a top surface 830 of each of the first,second, and third half-bridge modules 305. The first, second, and thirdphase outputs 825 can form connection points to couple with differentsystems within a drive train unit of an electric vehicle. For example,each of the first, second, and third phase outputs 825 can be configuredto provide a single phase voltage such the first, second, and thirdphase outputs 825 in combination can provide a three phase voltage. TheDC connector 705 (e.g., HV connector) is coupled with the positivebus-bar 455 and the negative bus-bar 460. The DC connector 705 can becoupled with a power supply (e.g., DC power supply) and be configured toprovide power to the positive bus-bar 455 and the negative bus-bar 460and thus power the first, second, and third half-bridge modules 305.

FIG. 9 shows the first, second and third half-bridge modules 305, ofFIGS. 8 and 9 rotated to further illustrate the coupling between thefirst, second and third half-bridge modules 305 and the positive andnegative bus-bars 455, 460. The first half-bridge module 305 includes afirst positive input 905 and a first negative input 910. The firstpositive input 905 is coupled with the positive bus-bar 455 and thefirst negative input 910 is coupled with the negative bus-bar 460. Thesecond half-bridge module 305 includes a second positive input 905 and asecond negative input 910. The second positive input 905 is coupled withthe positive bus-bar 455 and the second negative input 910 is coupledwith the negative bus-bar 460. The third half-bridge module 305 includesa third positive input 905 and a third negative input 910. The thirdpositive input 905 is coupled with the positive bus-bar 455 and thethird negative input 910 is coupled with the negative bus-bar 460.

The first, second and third half-bridge modules 305 are positionedadjacent to each other in a triplet configuration having each of theirrespective positive inputs 905 and negative inputs 910 aligned with eachother. Thus, the positive bus-bar 455 and the negative bus-bar 460 canbe disposed adjacent to each other and parallel to each other along thesame side surface 810 of each of the first, second and third half-bridgemodules 305. For example, the each of the first, second, third positiveinputs 905 can be positioned or formed such that they are at a firstlevel or first height along the first side surfaces 810 of thehalf-bridge modules 305. Each of the first, second, third negativeinputs 910 can be positioned such that they are at a second level orsecond height along the first side surfaces 810 of the half-bridgemodules 305.

The positive inputs 905 can be positioned at a different level or height(e.g., above, below) with respect to the negative inputs 910 along thefirst side surfaces 810 of the half-bridge modules 305. The positiveinputs 905 and the negative inputs 910 can be disposed at differentlevels so that the positive bus-bar 455 is spaced from the negativebus-bar 460. The spacing of the positive inputs 905 and the negativeinputs 910 can be selected and formed to meet clearance needs orrequirements between the positive bus-bar 455 and the negative bus-bar460. For example, the positive inputs 905 can be positioned above thenegative inputs 910 or the positive inputs 905 can be positioned belowthe negative inputs 910. The first positive input 905 can be positionedsuch that it is directly aligned (e.g., directly over, directly under)or offset with respect to the negative input 910. For example, and asdepicted in FIG. 9, the positive inputs 905 are offset with respect tothe corresponding negative inputs 910.

The positive bus-bar 455 and negative bus-bar 460 can be positioned suchthat they couple with each of the half-bridge modules 305 in arelatively straight arrangement. The straight and parallel arrangementallows the positive bus-bar 455 and negative bus-bar 460 to occupy lessroom within the inverter module 300. Thus, the inverter module 300 canbe formed having a compact design. The straight and parallel arrangementcan increase an efficiency of the manufacture as the positive andnegative bus-bars 455, 460 can be coupled with the same side surfaces810 of each of the half-bridge modules 305 in a relatively straightfashion. The first, second, and third half-bridge modules 305 can bealigned such their side surfaces, ends, top surfaces, and bottomsurfaces are aligned with respect to each other. For example, and asdepicted in FIG. 9, the first side surfaces 810 of the first, second,and third half-bridge modules 305 are aligned with respect to eachother. The second side surfaces 820 of the first, second, and thirdhalf-bridge modules 305 are aligned with respect to each other. The topsurfaces 830 of the first, second, and third half-bridge modules 305 arealigned with respect to each other.

FIG. 10 shows a bottom view of the first, second and third half-bridgemodules 305 to illustrate different circuitry components coupled withthe first, second and third half-bridge modules 305. For example, thecontrol PCB 425 is coupled with each of the first, second and thirdhalf-bridge modules 305. Further, multiple power PCBs 420 are coupledwith the first, second and third half-bridge modules 305. The controlPCB 425 and the power PCBs 420 can include control electronics and powerelectronics to control operation of the half-bridge modules 305. Thecontrol PCB 425 can be coupled with each of the first, second and thirdhalf-bridge modules 305 to provide controls signals to the first, secondand third half-bridge modules 305. For example, the control PCB 425 cangenerate control signals to activate (e.g., turn-on) or deactivate(e.g., turn-off) one or more of the first, second and third half-bridgemodules 305.

Each of the first, second, and third half-bridge modules 305 can couplewith at least one power PCB 420. For example, and as illustrated in FIG.10, a first power PCB 420 couples with the first half-bridge module 305through a first cold plate of the first half-bridge module 305. A secondpower PCB 420 couples with the second half-bridge module 305 through asecond cold plate of the second half-bridge module 305. A third powerPCB 420 couples with the third half-bridge module 305 through a thirdcold plate of the first half-bridge module 305. The power PCBs cancouple with a first surface (e.g., bottom surface, top surface) of thecold plates within the half-bridge modules 305 such that power PCBs arecoupled with an opposite surface of the cold plate as compared to asecond surface of the cold plate (e.g., top surface, bottom surface)that is positioned adjacent to or proximate to a capacitor ortransistors within the half-bridge modules 305. The power PCBs 420 cancorrespond to power supply PCBs and generate power signals for thehalf-bridge modules 305. The power PCBs 420 can provide the powersignals to control a power level or output level of one or more of thefirst, second and third half-bridge modules 305.

The half-bridge modules 305 can include low voltage PCB wires 1015 andhigh voltage PCB wires 1020. The low voltage PCB wires 1015 can couplethe control PCB 425 to the first, second, and third half-bridge modules305. For example, the low voltage PCB wires 1015 can loop through orcouple different portions of the control PCB 425 with the half-bridgemodules 305. The high voltage PCB wires 1020 can couple the power PCBs420 to the half-bridge modules 305. The high voltage PCB wires 1020 canthrough or couple different portions of the power PCBs 420 with thehalf-bridge modules 305.

A DC connector 705 (e.g., HV connector) couples with the positivebus-bar 455 and the negative bus-bar 460. The DC connector 705 can beformed on or coupled with a first end surface 1030 of the invertermodule 300. The DC connector 705 can provide a high voltage power sourcecorresponding to a first voltage range (e.g., high voltage range) to thepositive bus-bar 455 and the negative bus-bar 460. An LV connector 1005couples with a second end surface 1035 (e.g., opposite end from firstend 1830) of the inverter module 300. The LV connector 1005 can providea low voltage power source corresponding to a second voltage range(e.g., low voltage range) to the inverter module 300.

FIGS. 11-12 show various views of a gel tray 1105. The gel tray 1105(e.g., potting compound container) can include poly carbon material, orother forms of high temperature plastic. The gel tray 1105 can be formedusing various injection molded techniques. The gel tray 1105 can bedisposed over one or more components of a half-bridge module 305 orinverter module 300 and operate as an insulator for the components(e.g., electronics) of the half bridge module 305 or inverter module300. The gel tray 1105 can include or be formed having an inner region1210 that covers, submerges, or can be disposed about multiplecomponents of a half-bridge module 305 or inverter module 300. Forexample, components such as but not limited to a capacitor, transistors,or PCBs can be submerged by or otherwise disposed within the innerregion 1210 to provide cooling to the respective components.

The gel tray 1105 includes one or more capacitive orifices 1120. Thecapacitive orifices 1120 can be used as inputs or outputs for ahalf-bridge module 305 or inverter module 300. For example, thecapacitive orifices 1120 can be formed as a hole or an access point tocouple a power supply with DC connector, positive bus-bar, or negativebus-bar disposed within the gel tray 1105. The capacitive orifices 1120can be formed as a hole or an access point to provide a power (e.g.,voltage) generated by a half-bridge module 305 or inverter module 300 toother systems, such as a drive train unit of an electric vehicle.

The gel tray 1105 includes one or more connection points 1225. Theconnection points 1225 can include threaded inserts, holes, orreceptacles. The connection points 1225 can be used to couple the geltray 1105 to other components of a half-bridge module 305 or invertermodule 300. For example, the connection points 1225 can receive afastener (e.g., screw, bolt) to couple the gel tray 1105 to one or moreshallow regions of a cold plate. The gel tray 1105 can be formed in avariety of different shapes and having different dimensions. As depictedin the FIGS. 11-12, the gel tray 1105 can be formed having a rectangularshape. The shape and dimensions of the gel tray 1105 can be selectedbased in part on the shape and dimensions of a half-bridge module 305 orinverter module 305 the gel tray 1105 is coupled with.

FIG. 13 illustrates a half-bridge module 305 having a positive phaseinput 905, a negative phase input 910, a thermal pad 1350, and a coldplate 1340. The positive phase input 905 and negative phase input 910are coupled or disposed on a first side surface 1320 of the half-bridgemodule 305 (e.g., on the same side). By having the positive phase input905 and negative phase input 910 on the same first side surface 1320,positive and negative bus-bars to be arranged in a straight and parallelfashion with respect to each other. The positive phase input 905 can bedisposed at a different height or level with respect to the negativephase input 910. For example, the positive phase input 905 can bedisposed higher or lower than the negative phase input 910 along thefirst side surface 1320 of the half-bridge module 305. The positivephase input 905 can be disposed offset as compared to the negative phaseinput 910 in one or more directions (e.g., horizontally, vertically)along the first side surface 13205 of the half-bridge module 305.

The positive phase input 905 can be coupled with a thermal pad 1350 by aclearance layer 1325. The clearance layer 1325 can include copper or toother forms of sheet metal and can be disposed to provide clearance forthe positive phase input 905 from a negative bus-bar when thehalf-bridge module 305 is coupled within an inverter module 300 havingmultiple half-bridge modules 305. The thermal pad 1350 can be disposedbetween the positive phase input 905, the negative phase input 910 andthe cold plate 1340. The thermal pad 1350 is disposed over or in atleast one slot of a locator 1360. The locator 1360 is disposed over thecold plate 1340. The thermal pad 1350 can be disposed within a slot ofthe locator 1360 such that a portion of the thermal pad 1350 is incontact with a portion of the cold plate 1340. The thermal pad 1350 andthe cold plate 1340 can provide active cooling to the positive phaseinput 905 and the negative phase input 910. For example, the thermal pad1350 an the cool plate 1340 can provide heat dissipation or heatrejection for heat generated at or by the positive phase input 905 andthe negative phase input 910.

A PCB 1310 can be coupled with a side surface 1315 of the half-bridgemodule 305. The PCB 1310 may be coupled with a different surface 1315than the first side surface 1320 the positive phase input 905 and thenegative phase input 910 are coupled with. The half-bridge module 305can include a gel tray 1105 disposed over different components of thehalf-bridge module 305. The half-bridge module 305 can include one ormore mounting tabs 1330. The mounting tabs 1330 can couple withdifferent surfaces within an inverter module 300 to couple thehalf-bridge module 305 within the inverter module 300. The half-bridgemodule 305 can include a receptacle 1370 (e.g., assembly dowelreceptacle) formed on the first side surface 1320. The receptacle caninclude an orifice or hole and be used during a manufacture process tograb or position the half-bridge module 305 such that the half-bridgemodule 305 can be disposed within an inverter module 300.

FIG. 14 shows a half-bridge module 305 of FIG. 13 with a rotated view toshow a phase output terminal 805 coupled with a second side surface 1450of the half-bridge module 305. The phase output terminal 805 can becoupled with an opposite side surface 1450 as compared to the first sidesurface 1320 the positive phase input 905 and the negative phase input910 are coupled with. The phase output terminal 805 includes an orifice1405. For example, the orifice 1405 can have a square, round or circularshape and include a threaded inner region to receive a threadedconnection from a phase bus-bar. The orifice 1405 may include or couplewith a captive nut or a cage nut to form a connection between the phaseoutput terminal 805 and the phase bus-bar.

A thermal pad 1350 is disposed between the phase output terminal 805 anda cold plate 1340. The thermal pad 1350 is disposed over or in at leastone slot of a locator 1360. The locator 1360 is disposed over the coldplate 1340. The thermal pad 1350 can be disposed within a slot of thelocator 1360 such that a portion of the thermal pad 1350 is in contactwith a portion of the cold plate 1340. The thermal pad 1350, incombination with the cold plate 1340, can provide active cooling to thephase output terminal 805. For example, the thermal pad 1350 and coldplate 1340 can provide heat dissipation or heat rejection for heatgenerated at or by the phase output terminal 805. The thermal pad 1350can be in contact with a surface or portion of the phase output terminal805 or the thermal pad 1350 may be spaced a predetermined distance fromthe phase output terminal 805. The thermal pad 1340 can includenon-conductive material, such as but not limited to, aluminum oxide,aluminum nitride, silicon material or a silicon aluminum blend material.

The half-bridge module 305 includes a HV connector 1410 and a LVconnector 1420. The HV connector 1410 and the LV connector 1420 can becoupled with or disposed on a common side surface, here surface 1440.The HV connector 1410 and the LV connector 1420 may be coupled with ordisposed on different side surfaces of the half-bridge module 305. TheHV connector 1410 may extend a first distance from the side surface 1440and the LV connector 1420 may extend a second, different distance fromthe side surface 1440. The first distance may be less than or greaterthan the second distance. The HV connector 1410 and the LV connector1420 can extend from the side surface 1440 to provide a more accessibleconnection point to couple with a power source or to provide power todifferent components of an inverter module 300 or a drive train unit ofan electric vehicle. For example, the HV connector 1410 can couple witha high voltage power source to receive voltage in a first voltage rangefor the half-bridge module 305. The LV connector 1420 can couple with alow voltage power source to receive voltage in a second voltage rangefor the half-bridge module 305.

A PCB 1430 can couple the LV connector 1420 to the side surface 1440 ofthe half-bridge module 305. The PCB 1430 can extend from the sidesurface 1440 to electrically couple the LV connector 1420 to differentcomponents, electronics or circuitry within the half-bridge module 305.The PCB 1430 can include circuitry to transfer power provided to the LVconnector 1420 to different components, electronics or circuitry withinthe half-bridge module 305. A gel tray 1105 can be coupled with ordisposed over components of the half-bridge module 305. The gel tray1105 can be positioned such that it covers multiple sides of components(e.g., capacitor, transistor, PCBs) within the half-bridge module 305.

FIG. 15 shows the half-bridge module 305 rotated to show a bottom viewand in particular, a view of a bottom surface 1505 of the cold plate1340. The cold plate 1340 is coupled with the gel tray 1105 through aplurality of fasteners 1520. For example, a surface 1505 (e.g., bottomsurface, top surface) of the cold plate 1340 can include a plurality ofholes (e.g., threaded holes) to receive the plurality of fasteners 1520.The fasteners 1520 can extend through the cold plate 805 and couple withthreaded holes formed in the gel tray 1105. In this arrangement, thefasteners 1520 can be coupled away from electronics or other conductivecomponents, conductive surfaces (e.g., input terminals 905, 910, outputterminals, capacitor) of the half-bridge module 305. The fasteners 1520may be spaced a predetermined distance from electronics or otherconductive components, or conductive surfaces of the half-bridge module305.

For example, and as illustrated in the FIG. 15, the positive input 905and the negative input 910 are spaced from the fasteners 1520 to, forexample, avoid an electrical short between the positive input 905, thenegative input 910 and the fasteners 1520. Thus, the half-bridge module305 can be formed having adequate clearances/isolation between highvoltage conductors and ground (cold plate, fasteners, clips). Forexample, non-conductive materials, surfaces (e.g., plastic, thermal pad)may disposed next to or adjacent to the conductive materials, surfacesof the half-bridge module 305.

The fasteners 1520 can include fasteners of different sizes anddimensions. For example, the half-bridge module 305 may include fourfirst fasteners 1520 and four second fasteners 1520 with at least onefirst fastener 1520 and at least one second fastener 1520 coupled ateach corner of the cold plate 1340. The first fasteners 1520 can besmaller in size than the second fasteners 1520. The first fasteners 1520can correspond to gel tray fasteners to couple the gel tray 1105 withthe cold plate 1340. The second fasteners 1520 can correspond tocapacitor fasteners to couple the capacitor or capacitor frame to thecold plate 1340.

A first PCB 1430 can couple with and extend from a first side surface1550 of the half-bridge module 305 and a second PCB 1430 can couple withand extend from a second side surface 1560 of the half-bridge module305. The PCBs 1430 can couple with at least one LV connector 1420. Forexample, and as depicted in FIG. 15, the first PCB 1430 couples with afirst LV connector 1420 and the second PCB 1430 couples with a second LVconnector 1420. The PCBs 1430 can include circuitry to transfer powerprovided to the LV connectors 1420 to different components, electronicsor circuitry within the half-bridge module 305. The LV connectors 1410can couple with a power source to provide power in a second voltagerange (e.g., low voltage) to the half-bridge module 305. A first HVconnector 1410 is coupled with and extends from the first side surface1550 of the half-bridge module 305 and a second HV connector 1410 iscoupled with and extends from the second side surface 1560 of thehalf-bridge module 305. The HV connectors 1410 can couple with a powersource to provide power in a first voltage range (e.g., high voltage) tothe half-bridge module 305.

The cold plate 1340 includes one or more coolant ports 1510. Forexample, and as depicted in FIG. 15, the a first coolant port 1510 canbe formed through the surface 1505 of the cold plate 1340 at a first endand a second coolant port 1510 can be formed through the surface 1505 ofthe cold plate 1340 at a second, different end. The coolant ports 1510can be formed as orifices or holes formed through the surface 1505 ofthe cold plate 1340. The coolant ports 1510 can be fluidly coupled witheach other through a tube or conduit disposed within the cold plate 1340or a half-bridge module 305 that the cold plate 1340 is disposed within.The coolant ports 1510 can be fluidly coupled with one or more coolingpassages or cooling channels formed within the cold plate 1340 such thatcoolant can be provided to the cooling channels within the cold plate1340 through the coolant ports 1510.

The half-bridge module 305 can include one or more mounting tabs 1540.The mounting tabs 1540 can include holes, tabs, or flanges formed atends or side surfaces of the half-bridge module 305. For example, and asdepicted in FIG. 15, the mounting tabs 1540 can be formed at each cornerof the half-bridge module 305 such that the half-bridge module 305includes four mounting tabs 1540. The mounting tabs 1540 can receive orcouple with connection points within an inverter module 300 to couplethe half-bridge module 305 with the inverter module 300 or with otherhalf-bridge modules within the inverter module 300.

FIGS. 16-17 provides a cut away view of a half-bridge module 305 havinga capacitor 115, first and second transistors 120, and a cold plate 1605disposed within the half-bridge module 305. The capacitor 115 isdisposed over first and second transistors 120 and a clip 1620 isdisposed between the first and second transistors 120. The clip 1620includes two gull wings 1625. For example, a first gull wing 1625extends out and over the first transistor and a second gull wing 1625extends out and over the second transistor 120. The gull wings 1625 ofthe clip 1620 can compress or otherwise hold the first and secondtransistors 120 in place and against a ceramic layer 1630 disposedbetween the first and second transistors 120 and the cold plate 1605.For example, the gull wings 1625 can be positioned to compress the firstand second transistors 120 towards the cold plate 1605 to increase thecooling provided by the cold plate 1605.

A third PCB or temperature sensing PCB 1650 can be disposed between theclip 1620 and a first surface (e.g., top surface) of a locator 1640. Thethird PCB 1650 can include a temperature sensor and be configured toprovide temperature data (e.g., temperature readings) corresponding tothe first and second transistors 120. For example, the temperaturesensor (e.g., thermistor) can operate to provide temperature sensingcapability within the half-bridge module. The third PCB 1650 can beconfigured to determine or predict transistor junction temperatures(e.g., IGBT junction temperatures) within the half-bridge module 305.The locator 1640 can include a plurality of slots to hold or couple withthe first and second transistors 120, the clip 1620, and the third PCB1650.

The locator 1640 can be disposed over or on the ceramic layer 1630. Theceramic layer 1630 may include ceramic based material and be configuredto electrically insulate the cold plate 1605 from the first and secondtransistors 120. For example, the ceramic layer 1630 can be configuredto prevent a short circuit condition between the cold plate 1605 and thefirst and second transistors 120.

The cold plate 1605 includes the plurality of cooling passages 1610 inwhich coolant can by pumped or otherwise provided through. The coolingchannels 1610 can be formed within the cold plate 1605 such that theyare positioned proximate to or within a predetermined distance from theplurality of transistors 120, here the first and second transistors 120.The cold plate 1605 can include aluminum or an aluminum heat sink. Thecold plate 1605 can include one or more different layers or one or moredifferent materials. The different layers of the cold plate 1605 can beformed into a single layer during manufacture, such as by friction stirweld construction.

The first transistor 120 includes a first set of leads 1675 coupled witha first PCB 1680 and the second transistor 120 includes a second set ofleads 1675 coupled with a second PCB 1680. The first set of leads 1675can extend through an orifice or hole formed in the first PCB 1680 tocouple the first transistor 120 with the first PCB 1680. The first PCB1680 can include control circuitry to generate and provide controlsignals to the first transistor 120 to activate (e.g., turn-on) orde-activate (e.g., turn-off) the first transistor 120. The second set ofleads 1675 can extend through an orifice or hole formed in the secondPCB 1680 to couple the second transistor 120 with the second PCB 1680.The second PCB 1680 can include control circuitry to generate andprovide control signals to the second transistor 120 to activate (e.g.,turn-on) or de-activate (e.g., turn-off) the first transistor 120.

The capacitor 115 includes a first set of leads 1670 coupled with thefirst PCB 1680 and a second set of leads 1670 coupled with the secondPCB 1680. The first set of leads 1670 and the second set of leads 1670can include or be formed having a curved or bent shape to accommodatecoupling with the first and second PCBs 1680. The first set of leads1670 and the second set of leads 1670 can extend through an orifice orhole formed in the first and second PCB's 1680 to couple the capacitor115 with the first and second PCB's 1680. The first and second PCB's1680 can include or be coupled with control circuitry (e.g., IGBTcontrol circuitry) and can be configured to provide control signals tothe capacitor 115 to control operation of the capacitor 115. The firstand second PCBs 1680 can be oriented vertically with respect to thecapacitor 115 and have minimal conductor length between the transistors120 (e.g., IGBT dies) and control circuitry of the first and second PCBs1680.

FIG. 17 provides a cut-away view of the spatial relationship between theclip 1620, the first transistor 120, the ceramic layer 1630, the locator1640, and the cold plate 1605. For example, the first gull wing 1625 ofthe clip 1620 can contact a first surface (e.g., top surface) of thefirst transistor 120 can compress the first transistor towards theceramic layer 1630 and the cold plate 1605 to increase a coolingprovided by the cold plate 1605. A first thermal grease layer orbondline 1705 can be disposed between a second surface (e.g., bottomsurface) of the first transistor 120 and a first surface (e.g., topsurface) of the ceramic layer 1630. A second thermal grease layer orbondline 1705 can be disposed between a second surface (e.g., bottomsurface) of the ceramic layer 1630 and a first surface (e.g., topsurface) of the cold plate 1605.

In FIG. 18, the half-bridge module 305 of FIG. 17 is provided showing ahalf-bridge module circuit 100 formed by the components of thehalf-bridge module 305. The circuit 100 can be formed between componentsof the half-bridge module 305, such as the capacitor 115 and first andsecond transistors 120. For example, the circuit 100 includes a positiveterminal 105 coupled with at least one terminal of the capacitor 115 anda negative terminal 110 coupled with a second terminal of the capacitor115. The positive terminal 105 is coupled between the capacitor 115 andthe first transistor 120. The negative terminal 110 is coupled betweenthe capacitor 115 and the second transistor 120.

The first transistor 120 can include at least one terminal (e.g.,emitter terminal) coupled with a phase output terminal 130 and thesecond transistor 120 can include at least one terminal (e.g., collectorterminal) coupled with the phase terminal 130. The first and secondtransistors 120 can operate as switches within the half-bridge module305. The positive terminal 105 can be coupled with a positive inputterminal of the half-bridge module 305 and the negative terminal 110 canbe coupled with a negative input terminal of the half-bridge module 305.The phase terminal 130 can be coupled with a phase output of thehalf-bridge module 305 to provide a single phase output voltagegenerated by the half-bridge module 305 for a drive unit of an electricvehicle.

FIGS. 19-21, provide cut-away views of a half-bridge module 305illustrating the spatial relationship between the different componentsof the half-bridge module 305. The half-bridge module 305 includes a geltray 1105 disposed about or over a capacitor 115. The half-bridge module305 includes a positive phase input 905, a negative phase input (notshown), and a phase output terminal 805. The positive phase input 905,the negative phase input (not shown), and the phase output terminal 805can be coupled with the capacitor 115. For example, a first conductor1915 can couple the capacitor 115 with the positive input 905, a secondconductor 1915 can couple the capacitor 115 with the negative input (notshown), and a third conductor 1915 can couple the capacitor 115 with thephase output terminal 805. The conductors 1915 can include conductivematerial (e.g., copper). The conductors 1915 can be formed having a bentshape, curved shape or a U-shape to couple at least one of the positivephase input 905, the negative phase input (not shown), or the phaseoutput terminal 805 with the capacitor 115.

The positive phase input 905, the negative phase input (not shown), andthe phase output terminal 805 may include conductive materials, such asbut not limited to, copper. The gel tray 1105 can be disposed such thatit is disposed over the capacitor 115 and includes orifices (e.g.,holes) to provide a connection between the positive phase input 905, thenegative phase input (not shown), the phase output terminal 805, and thecapacitor 115.

The half-bridge module 305 includes a plurality of transistors 120coupled with a locator 1640 using a plurality of clips 1620. The clips1620 can couple with the locator 1640 through threaded inserts formed inthe locator 1640. The clips 1620 can include gull wings 1625 to extendout and over the transistors 120 such that the gull wings 1625 compressand hold the transistors 120 in place in slots formed in the locator1640. The locator 1640 is disposed over a ceramic layer 1630. Theceramic layer 1630 is disposed over a cold plate 1605 having a pluralityof cooling channels 1610. The cooling channels 1610 can be formed suchthat they are aligned (here under) the capacitor 115 and transistors 120to provide cooling to the capacitor 115 and the transistors 120.

As depicted in FIG. 20, a PCB 1650 can be coupled with the locator 1640by the clips 1620. The PCB 1650 can include at least one temperaturesensor 2015 (e.g., thermistor) coupled with or formed within the PCB1650. The temperature sensor 2015 can measure temperatures for one ormore transistors and the PCB 1650 can generate temperature datacorresponding to the one or more transistors. Further, and as depictedin FIG. 20, the PCB 1650 is disposed between the transistors 120 and thelocator 1640. The ceramic layer 1630 is disposed between the locator1640 and the cold plate 1605. The ceramic layer 1630 can operate as anelectrical insulator between the locator 1640 and the cold plate 1605.

Referring back to FIG. 19, at opposing ends of the half-bridge module305, thermal pads 1940 can be disposed between a portion of the coldplate 1605 and a portion of the capacitor 115. The thermal pads 1940 canoperate as a thermal interface between the electronics of thehalf-bridge module 305, here the capacitor 115 and the cold plate 605.For example, the thermal pads 1940 can provide active cooling for inputs905 and outputs 805 of the half-bridge module 305. As depicted in theFIG. 19, a first thermal pad 1940 is disposed proximate to and alignedwith (e.g., positioned under) the positive input 905 (and the negativeinput) and a second thermal pad 1940 is disposed proximate to andaligned with (e.g., positioned under) the phase output terminal 805.Further, a first portion of the cold plate 1605 can be aligned with(e.g., positioned under) the positive input 905 (and negative input) anda second portion of the cold plate 1605 can be aligned with (e.g.,positioned under) the phase output terminal 805. The thermal pads 1940and cool plate 1605 can provide active cooling to conductors in thehalf-bridge module 305. For example, and depending on thespecifications, dimensions (e.g., thickness) and temperature gradientswithin the capacitor 115, the thermal pads 1940 and cool plate 1605 mayprovide heat dissipation or heat rejection in a range from 50 watts to100 watts for a single half-bridge module 305. The thermal pads 1940 caninclude aluminum oxide, aluminum nitride, silicon material or a siliconaluminum blend material.

The cold plate 1605 can be formed having a shape based on the design ofthe half-bridge module 305. For example, the cold plate 1605 can includetwo shallow regions 1990 and a hump region 1995 formed between the twoshallow regions 1990. The geometry of the cold plate 1605 can operate toraise the electronics (e.g., high-voltage conductors within capacitor115, transistors 120, PCB 1650) into an inner area defined by the geltray 1105 such that the electronics of the half-bridge module 305 areeffectively submerged or otherwise covered by the gel tray 1105 onmultiple sides, here at least three sides. The shape, size anddimensions of the hump region 1995 can vary and be selected at leastbased in part on the shape, size and dimensions of one or morecomponents of the half-bridge module 305. For example, a height of thehump region 1995 can be selected such that the transistors 120 or IGBTcomponents of the half-bridge module 305 are submerged within the geltray 1105.

FIG. 21 illustrates the shallow regions 1990 that are formed such thatouter edges 2105 of the gel tray 1105 extend down and are in contactwith the conductors 1915 (e.g., positive conductors, negativeconductors, phase bar, lead-frame of capacitor 115). The edges 2105 ofthe gel tray 1105 can be in contact with a portion of the conductor1915. The conductor 1915 can be disposed over the thermal pad 1940 andthe thermal pad 1940 is disposed over a portion of the cold plate 1605.Thus, the edges 2105 of the gel tray 1105 can extend down to be within apredetermined distance from the thermal pad 1940 and the cold plate1605. The hump region 1995 of the cold plate 1605 can extend or raisethe electronics of the half-bridge module 305 into the inner regionformed by the gel tray 1105 and the edges 2105 can extend down such thatthe gel tray 1105 submerges the electronics of the half-bridge module305. The outer edges 2105 may couple with the shallow regions 1990 ofthe cold plate 1605.

FIG. 22 shows a plurality of transistors 120 coupled with or otherwisedisposed in slots 2205 of a locator 1640 (which can also be referred toherein as a locator guide, locator frame). In FIG. 22, the transistors120 have leads 205 having a generally straight or unbent shape. When thetransistors 120 are fully coupled with a half-bridge module 305, theleads 205 can be bent, shaped or otherwise manipulated to couple with arespective one or more components (e.g., PCB) within the half-bridgemodule 305.

A PCB 2215 is coupled with the locator 1640. The PCB 2215 may includecontrol electronics for a temperature sensor (e.g., thermistor) disposedon an opposite side of the locator 1640 (e.g., opposite with respect tothe surface of the locator 1640 that the transistors 120 are disposedon). The temperature sensor can operate to provide temperature sensingcapability within the half-bridge module. For example, the temperaturesensing can be extrapolated to predict IGBT junction temperatures. Thetemperature sensor (e.g., board-level thermistor) can be compressed andsealed against a pocket of grease on a ceramic layer, adjacent to thetransistors 120.

A first thermal pad 1940 is coupled with the locator 1640 at a first end2230 of the locator 1910 and a second thermal pad 1940 is coupled withthe locator 1640 at a second end 2235 of the locator 1640. The first andsecond thermal pads 1940 can be coupled with the same side or surface ofthe locator 1640 and be disposed on opposite ends, here the first end2230 and second end 2235, of the locator 1640 such that the transistors120 are disposed between the first and second thermal pads 1940.

A plurality of clips 1620 can couple the transistors 120 with thelocator 1640. Each of the clips 1620 includes at least two gull wingportions 1625 extending out from a center portion of the respective clip1620 and over at least one of the plurality of transistors 120. Forexample, the gull wing portions 1625 can compress and hold thetransistors 120 in place and in contact with the locator 1640. Forexample, and now referring to FIG. 23, an exploded view of clips 1620compressing transistors 120 towards a cold plate 1605 is provided. Theclips 1620 include gull wing portions 1625 that extend out and over asurface (e.g., top surface) of the transistors 120 to secure thetransistors 120 and compress the transistors 120 towards a thermalinterface formed between a ceramic layer 1630 and the cold plate 1605.For example, the cold plate 1605 includes a plurality of coolingchannels 1610 having coolant flowing through, and the gull wings 1625can compress the transistors 120 closer to the cooling channels 1610 toincrease the cooling provided by the cooling channels 1610 and the coldplate 1605. The ceramic layer 1630 is disposed between the transistors120 and the cold plate 1605 to electrically insulate the transistors 120from the cold plate 1605.

The transistors 120 are coupled with the locator 1640 using the clips1620. For example, the clips 1620 can include a threaded portion thatcan couple with a threaded receiving portion of the locator 1640 andcold plate 1605 to secure the transistors 120 in place. Further, and asdepicted in FIG. 23, the PCB 1650 is disposed between the clips 1620 anda top surface of the locator 1640. The PCB 1650 can be secured in placeagainst the locator 1640 by the clips 1620.

As illustrated in FIG. 23, portions of the locator 1640 can extendaround the cold plate 1605 such that the cold plate 1605 can be formedor otherwise disposed within an inner region or inner recess of thelocator 1640. The shape of the locator 1640 can position the cold plate1605 to a closer distance (e.g., proximity) or within a predetermineddistance to components within a half-bridge module 305. For example, thecold plate 1605 can be spaced from the transistors 120 a distance in arange from 0.25 mm to 1 mm (e.g., less than 1 mm). The cold plate 1605can be separated from the transistors 120 by a sheet of ceramic materialhaving a thickness or width of less than 1 mm. For example, theplurality of cooling passages 1610 having coolant fluid provided to orflowing through can be positioned in a closer proximity to cool thedifferent electronics (e.g., transistors 120) or other components of ahalf-bridge module 305.

FIG. 24 shows the locator 1640 with the components of a half-bridgemodule 305 removed from the frame. The locator 1640 includes a pluralityof slots (e.g., apertures, holes, recesses) formed in a frame of thelocator 1640 to hold or couple various components of the half-bridgemodule 305 in place. The slots can have varying shapes, sizes anddimensions and the shapes, sizes and dimensions of a particular slot canbe selected based at least in part on the shape, size or dimension of acomponent of a half-bridge module 305.

As depicted in FIG. 24, the locator 1640 includes two thermal pad slots2405 formed at opposite ends of the locator 1640, sixteen transistorslots 2410 (or IGBT slots), eight fastener slots 2415 and two thermistorslots 2420. The thermal pad slots 2405 have a generally rectangularshape which can be selected based on the shape of the particular thermalpad to be used in the half-bridge module 305. The transistors slots 2410have a generally rectangular shape which can be selected based on theshape of the particular transistors to be used in the half-bridge module305. The fastener slots 2415 can have a generally round shape and mayinclude a threaded inner surface to couple with a threaded portion of afastener. The thermistor slots 2420 can have a generally round shape.

A half-bridge module 305 may include only one thermistor, thus only onethermistor slot 2420 may be used. However, two thermistor slots 2420 canbe formed to provided symmetry and ease of manufacture. For example,having two thermistor slots 2420 allows for the locator 1640 to berotated and a thermistor of a half-bridge module 305 can be disposedwithin either thermistor slot 2420.

The locator 1640 can be formed having any number of slots, including agreater number of slots than described above with respect to FIG. 24 orless than the number of slots described above with respect to FIG. 24.The locator 1640 can operate as a guide or frame for a manufactureprocess of a half-bridge module 305, such as during a pick and placeautomation process, to increase an efficiency of the manufactureprocess. For example, the locator 1640 can keep different components orparts of the half-bridge module 305 form moving around duringmanufacture resulting in a reducing an amount of fixturing (e.g.,identifying and moving parts to correct locations) during themanufacture process. The half-bridge module 305 can be formed faster andmore efficiently using the locator 1640 as a guide for an automationdevice (e.g., pick and place automation machinery). The locator 1640 canreduce the amount of human interaction with a particular manufactureprocess and therefore, a half-bridge module 305 can be formed using justthe pick and place machinery and a grease dispenser device (or otherform of fluid device).

FIGS. 25-28 show cut-away views of a cold plate 1605. For example, andreferring to FIG. 25, a view of a bottom surface 2515 of the cold plate1605 is provided showing a first coolant port 2510 and a second coolantport 2510, each formed through the surface 2515 (e.g., bottom surface,top surface) of the cold plate 1605. The first coolant port 210 maycorrespond to an inlet port to receive coolant or an outlet port torelease coolant. The second coolant port 210 may correspond to an inletport to receive coolant or an outlet port to release coolant. Thecoolant ports 2510 can be formed orifices or holes formed through thesurface 2515 of the cold plate 1605. The coolant ports 2510 can befluidly coupled with each other through a tube, conduit, or coolingchannels formed in or disposed within the cold plate 1605 or ahalf-bridge module 305 that the cold plate 1605 is disposed within. Thecoolant ports 2510 can be fluidly coupled with one or more coolingpassages or cooling channels 1610 (as shown in FIG. 16) formed withinthe cold plate 1605 such that coolant can be provided to the coolingchannels 1610 within the cold plate 1605 through the coolant ports 2510.

The cold plate 1605 can include multiple coolant ports 2510. Forexample, the first coolant port 2510 can correspond to a coolant inputport or manifold configured to receive a liquid coolant and provide theliquid coolant to the cooling channels 1610. The second coolant port2510 can correspond to a coolant output port or manifold configured torelease the liquid coolant from the cooling channels 1610. The coolantports 2510 can be formed at opposing ends of the cold plate 1605 (asdepicted in FIG. 16) or the coolant ports 2510 can be formed at the sameend of the cold plate 1605.

FIG. 26 shows a top view of a top surface 2615 of the cold plate 1605.The top surface 1615 of the cold plate does not include coolant ports2510. Thus, the liquid coolant provided to the coolant ports 2510 flowsthrough the cold plate 1605 and is sealed or maintained within the coldplate 1605 in part by the top surface 2615 such that the cold plate 1605can provide cooling to electronics of a half-bridge module 305 the coldplate 1605 is disposed within. The cold plate 1605 may include at leastone surface (e.g., bottom surface 2515 or top surface 2615) having oneor more coolant ports 2510 formed thereon.

FIG. 27 shows a side view of the cold plate 1605. The side view showsthe cold plate 1605 having a first shallow region 1690 formed at a firstend of the cold plate 1605, a second shallow region 1690 formed at asecond end (e.g., different from the first end) of the cold plate 1605,and a hump region 1695 formed or disposed between the first shallowregion 1690 and the second shallow region 1690. The hump region 1695 canhave a greater height or thickness with respect to the first and secondshallow regions 1690. The first and second shallow regions 1690 can havethe same height or thickness with respect to each other.

FIG. 28 shows a cut away view of the cold plate 1605. The cut away viewshows the plurality of cooling channels 1610 formed within the coldplate 1605. Coolant can be provided to and flow through the coolingchannels 1610 of the cold plate 1605 to provide heat transfer forelectronics, conductors and other components within a respectivehalf-bridge module 305. The geometry of the cold plate 1605 can beselected and formed to enhance heat transfer between the material of thecold plate 1605 (e.g., aluminum) and the fluid flowing through thecooling channels 1610.

The cooling channels 1610 can be formed having a variety of differentshapes, different sizes, different dimensions, or different volumes andthe particular shape, size, dimensions or volume can be selected basedat least in part on a particular application of the cold plate 1605. Forexample, the cooling channels 1610 can be formed having a generallyround or circular shape. The cooling channels 1610 can hold coolantfluid. The cooling channels 1610 can be formed such that coolant fluidcan flow through each of them. For example, the cooling channels 1610can be fluidly coupled with each other or each of the cooling channels1610 can be fluidly coupled with at least one other different coolingchannel 1610. Each of the cooling channels 1610 can have the same shape,size, dimensions, or volume or one or more of the cooling channels 1610can have a different shape, a different size, different dimensions, or adifferent volume.

FIG. 29 illustrates the transistor 120 having leads 205 with the leads205 having a generally straight shape and coupled with a printed circuitboard (PCB) 1680. In particular, the leads 205 extend through a hole ororifice formed in the PCB 1680 to couple the transistor 120 with the PCB1680. The PCB 1680 may include control electronics to communicate andcontrol the transistor 120, such as, to turn the transistor 120 on oroff (e.g., open or close the switch). The leads 205 of the transistor120 can be unbent, and terminated to or otherwise coupled with the PCB1680 through a variety of different techniques, including but notlimited to, resistive welding. The length and dimensions of the leads205 of the transistor 120 can be selected based at least in part on adistance between the transistor 120 and the PCB 1680. For example, thestraight and unbent leads 205 of the transistor 120 can be short inlength to minimize parasitic inductance effects, relative to alternativedesigns where more of the transistor lead is utilized or the leads arebent to reach their target connections.

FIG. 30 illustrates the transistor 120 having leads 205 with the leads205 having a generally bent or curved shape. For example, the leads 205can be curved to form an angle of 90° with respect to a surface of thetransistor 120 (or in a range from 45° to 120° with respect to a surfaceof the transistor 120) and coupled with a PCB 3010. In particular, theleads 205 extend through a hole or orifice formed in the PCB 3010 tocouple the transistor 120 with the PCB 3010. The PCB 3010 may include orprovide a power supply to the transistor 120. For example, the PCB 3010may provide power signals to the transistor 120.

FIG. 31 shows an exploded view of a half-bridge module 305 illustratingthe relationship, order of assembly, or alignment of the differentcomponents that form the half-bridge module 305. For example, thehalf-bridge module 305 includes a gel tray 1105 disposed over acapacitor housing 115. First and second PCBs 1680 can couple with atleast two side surfaces of the capacitor housing 115. The capacitorhousing 115 can be disposed over a plurality of clips 1620 having gullwings, a third PCB 2215 and a plurality of transistors 120. Thetransistors 120 can be coupled with a locator 1640. For example, each ofthe transistors 120 can be disposed within at least one slot of thelocator 16400. The clips 1620 can compress and hold the transistors 120in the slots of the locator 1640 using their respective gull wings whichextend out and over a top surface of the transistors 120. The third PCB2215 can be disposed between the clips 1620 and a surface (e.g., topsurface) of the locator 1640.

The locator 1640 can be coupled with a cold plate 1605 with a ceramiclayer 1630 disposed between the locator 1640 and the cold plate 1605.The cold plate 1605 can be the structural connection between thehalf-bridge module 305 and the inverter module 300 the half-bridgemodule 305 is a component of or otherwise disposed within. For example,the cold plate 1605 can include connection points (e.g., mountingflanges, mountings tabs) to couple the cold plate 1605 with otherhalf-bridge modules 305 or couple the cold plate 1605 with connectionspoints within the inverter module 300.

The cold plate 1605 can include a hump region 1995 and two shallowregions 1990. The hump region 1995 can be formed having a height suchthat the electronics (e.g., capacitor 115, transistors 120, PCBs 1680,2215 of the half-bridge module 305 are raised up and into an inner areaformed by the gel tray 1105 when the half-bridge module 305 is fullyassembled. The electronics of the half-bridge module 305 can besurrounded by at least three or more side surfaces of the gel tray 1105when the half-bridge module 305 is fully assembled.

FIGS. 32-33 provide a method 3200 for assembling and manufacturing amain inverter. The main inverter can be a component of the half-bridgemodule, such as the half-bridge module described above with respect toFIGS. 1-31. The inverter module may include three half-bridge modules(which can also be referred to herein as a power stage, half-bridgeinverter modules, half-bridge inverter sub-modules) disposed in an innerarea of the inverter module having a triplet arrangement. Each of thehalf-bridge modules can include at least one coolant thermistor.

Method 3200 can include providing a temperature sensor, such as but notlimited to, a coolant thermistor for an inverter module (which can alsobe referred to herein as a main inverter) (ACT 3205). The half-bridgemodules can include different components to provide cooling for theelectronics of the respective half-bridge module. For example, eachhalf-bridge module can include a cold plate having a plurality ofcooling channels. The cold plate can be positioned such that it iswithin a predetermined distance of the electronics of the respectivehalf-bridge module to provide heat dissipation or heat rejection withinthe half-bridge module. Thus, each of the half-bridge modules caninclude at least one coolant thermistor to measure and providetemperature data for an environment within the half-bridge module.

Method 3200 can include installing the temperature sensor (e.g., coolantthermistor) into an enclosure (which can also be referring to herein asa housing for the inverter module) (ACT 3210). The half-bridge modulescan include one temperature sensor or multiple temperature sensors. Forexample, at least one temperature sensor can be installed next to oradjacent to a coolant inlet manifold, a coolant outlet manifold tomeasure a temperature of the coolant provided to the half-bridge module.A temperature sensor can be coupled with or embedded within a PCB thatis disposed between the electronics of the half-bridge module (e.g.,capacitor, transistors) and the cold plate of the half-bridge module.

Method 3200 can include installing a control board and electromagneticinterference (EMI) tray (ACT 3215). The control board andelectromagnetic interference (EMI) tray can be assembled atsubstantially the same time as the coolant thermistor (e.g.,simultaneously), the control board and electromagnetic interference(EMI) tray can be assembled prior to the coolant thermistor beingassembled or the control board and electromagnetic interference (EMI)tray can be assembled after the coolant thermistor is assembled. Thecontrol board can include a control PCB. The control board can includecontrol circuitry to generate control signals to control operation ofthe half-bridge modules within an inverter module. For example, aninverter module may include a single control board to control each ofthe half-bridge modules or an inverter module can include multiplecontrol boards.

A power PCB can be assembled and coupled with the half-bridge modules.An inverter module may include a single power PCB to power theelectronics of each of the half-bridge modules or an inverter module caninclude multiple power PCBs such that at least one power PCB is coupledwith each half-bridge module. The EMI shield can be disposed within theinverter module such that it is positioned between the control PCB andone or more power PCBs. The EMI shield can block of shieldelectromagnetic fields between different electronic components of thehalf-bridge module. The EMI shield can be disposed within the invertermodule such that it is positioned between the control PCB and one ormore power PCBs. The EMI shield can block of shield electromagneticfields between different electronic components of the half-bridgemodule.

Method 3200 can include rotating the enclosure (e.g., flipped) along anx-axis, y-axis or z-axis to seal one or more surfaces of the enclosure(ACT 3220). For example, the enclosure can be rotated to install faceseal O-rings between different edges or surfaces of the enclosure. Theenclosure may be flipped relative to a z-plane to expose at least onesurface (e.g., top surface, bottom surface) of the enclosure forcoupling with face seal O-rings.

Method 3200 can include providing a power stack assembly (ACT 3225).Providing the power stack assembly can include assembling a high voltageGDB (HV-GDB) harness. The harness can couple different electroniccomponents of the inverter module together, such as but not limited to,different PCBs within the inverter module. The harness can provide apath for control signals to be transmitted between different electroniccomponents of the inverter module. Providing the power stack assemblycan include assembling at least one half-bridge module of the invertermodule. The half-bridge module can include, but not limited to, a coldplate, ceramic layer, locator, thermal pads, PCBs, transistors, clips,capacitor, and a gel tray. Multiple half-bridge modules may be assembledhaving the same components, shape, size, and dimensions. The half-bridgemodule and the HV-GDB harness can be assembled at substantially the sametime (e.g., simultaneously), the half-bridge module can be assembledprior to the HV-GDB harness being assembled or after the HV-GDB beingassembled. The HV-GDB can be coupled with the half-bridge module. Theharness can couple the PCBs within the respective half-bridge module tocontrol circuitry of the inverter module.

Method 3200 can include installing the power stack assembly into theenclosure of the inverter module (ACT 3230). The power stack assembly ormultiple power stacks assembly can be assembled or disposed within theenclosure that forms the housing for the inverter module. Thehalf-bridge modules can be arranged in a triplet configuration such thattheir respective inputs (e.g., positive, negative) and outlets arealigned with respect to each other. The power stack assembly can becoupled with one or more temperature sensors (e.g., coolantthermistors), the control board (e.g., control PCB), and the EMI tray orEMI shield.

Installing the power stack assembly can include assembling a highvoltage DC (HVDC) connector. The DC connector can couple with at leastone side surface of the enclosure housing the inverter module. The DCconnector can couple with a power source to provide a voltage to thehalf-bridge modules forming the inverter module. For example, the DCconnector can couple with positive and negative bus-bars within theinverter module that provide the voltage to each of the inputs of thehalf-bridge modules. A control unit connector, such as a master controlunit (MCU) can be assembled. The MCU connector can be formed on orcoupled with at least one side surface of the enclosure. The MCUconnector can couple with an external control unit for providingcontrols signals to the inverter module. The HVDC connector and the MCUconnector can be assembled at substantially the same time (e.g.,simultaneously), the MCU connector can be assembled prior to the HVDCconnector being assembled or the MCU connector can be assembled afterthe HVDC connector is assembled.

Method 3200 can include providing a drive unit (ACT 3235). Providing thedrive unit can include installing housing mounted connectors within theenclosure of the inverter module. For example, DC terminals can bebolted or otherwise coupled within the enclosure of the inverter moduleusing the housing mounted connectors. The housing mounted connectors mayinclude the MCU connector and the HVDC connector. Thehigh-voltage-low-voltage (HV-LV) harness can be assembled. The LVharness can couple the PCBs in the individual half-bridge modules. Forexample, the LV harness can provide a low voltage to the different PCBswithin the individual half-bridge modules.

Providing the drive unit can include assembling an additionalhigh-voltage-low-voltage (HV-LV) harness. The HV-LV harness can couplehigh voltage and low voltage systems within the inverter module. Forexample, the HV-LV harness can couple a first PCB of the inverter moduleto a second PCB of at least one of the half-bridge modules. Providingthe drive unit can include assembling a gearbox bundled harness (ordrive unit bundled harness). The gearbox harness can couple a powersystem or power source of a drive train unit to the invert module. Forexample, the gearbox harness can electrically couple one or morehalf-bridge modules or the inverter module with different power systemsof a drive train unit to convey or transmit electrical signals betweenthe half-bridge modules or the inverter module and the power systems ofthe drive train unit.

Method 3200 installing the inverter into the drive unit harness (ACT3240). For example, installing the inverter into the drive unit harnesscan include installing the HV-LV harness, gearbox bundled harness and alow-voltage-GDB (LV-GDB) flex cables in the enclosure of the invertermodule. The HV-LV harness, gearbox bundled harness and a low-voltage-GDB(LV-GDB) flex cables can be installed using tie-downs or other forms ofconnectors. Method 3200 can include installing a lid onto the inverter(ACT 3245). For example, a lid and a gasket for the inverter module canbe installed and the inverter module having three half-bridge modulesarranged in a triplet configuration can be sealed. The lid and gasketcan couple with the enclosure using a plurality of fasteners.

FIGS. 34-40 provide a method 3400 for assembling and manufacturing ahalf-bridge module. The half-bridge module can be the same as thehalf-bridge modules described above with respect to FIGS. 1-31. Method3400 can include mounting a cold plate on a pick and place fixture (ACT3405). The pick and place fixture may include or be a component of apick and place automation system and can be configured to pick upcomponents (e.g., components of a half-bridge module) and place theminto a particular location, fixture, enclosure, system or parts nest foran assembly process or pull components out of a particular location,fixture, enclosure, system or parts nest for an assembly process andposition the respective component(s) for packaging or the a subsequentstage in the assembly process.

Method 3400 can include dispensing grease, liquid paste or other formsof a lubricant on the cold plate (ACT 3410). The lubricant can bedispensed by a liquid dispenser positioned proximate to the pick andplace fixture. The lubricant can be disposed over at least one surfaceof the cold plate. Method 3400 can include a ceramic layer or ceramicmaterial (ACT 3415). For example, the ceramic layer or ceramic materialcan be placed on one or more surfaces of the cold plate. The ceramiclayer can be disposed over the lubricant such that the lubricant layeris between the ceramic layer and the cold plate.

Method 3400 can include placing a locator for the half-bridge module(ACT 3420). The locator can include a plurality of slots to holdcomponents of the half-bridge module such that the locator can operateas a guide for the pick and place automation during manufacture of therespective half-bridge module. The locator can be disposed over theceramic layer such that the ceramic layer is disposed between the coldplate and the locator.

Method 3400 can include dispensing grease, liquid paste or other formsof a lubricant on the ceramic layer and between the ceramic layer andthe locator or cold plate (ACT 3425). The lubricant can be disposed overone or more surfaces of the locator. Method 3400 can include placing ordisposing a plurality of transistors within slots of the locator (ACT3430). The transistors may include insulated-gate bipolar transistors(IGBTs). The transistors can be disposed such that at least onetransistor is within at least one slot of the locator.

Method 3400 can include trimming leads for the transistors (ACT 3435).The leads of the transistors can be trimmed for coupling with one ormore circuit elements within the half-bridge module. For example, theleads can be sized and trimmed to couple with at least one PCB. Method3400 can include mounting a compression plate (ACT 3440). Thecompression plate can be used to hold (e.g., compress) the transistorsso that they do not move out of position during manufacture. Thecompression plate can be temporarily mounted to the transistors duringthe manufacture process.

Method 3400 can include installing one or more fasteners and one or moreclips (ACT 3445). The clips can include gull wings and can be installedsuch that their gull wings extend out and over the transistors to holdthe transistors in place, securing the transistors to the locator. Thefasteners can couple the clips with locator. Method 3400 can includeremoving the compression plate (ACT 3450). For example, with thetransistors secured by the clips and the fasteners, the compressionplate can be removed. Method 3400 can include placing one or morethermal pads (ACT 3455). For example, the one or more thermal pads canbe placed such that a tacky side coupled with a surface of the coldplate. The half-bridge module may include two thermal pads with eachthermal pad coupled with the cold plate at opposite ends or sides of thehalf-bridge module. The thermal pads can be disposed within thermal padslots of the locator. For example, the thermal pads can be disposed atopposing ends of the locator.

Method 3400 can include coupling a current assembly with a surface of acapacitor (ACT 3460). The capacitor may include a DCLSP cap disposed inthe assembly jig. The current assembly can be placed on a surface (e.g.,top surface, bottom surface) of the capacitor. Method 3400 can includeinstalling the capacitor in the half-bridge module (ACT 3465). Forexample, a DCLSP capacitor can be installed in the half-bridge modulesuch that it is posited over the transistors. The capacitor can couplewith the leads of the transistors to secure the capacitor to thetransistors. The capacitor can include a capacitor lead frame. Thecapacitor lead frame and include leads that couple with one or more PCBsto hold the capacitor in place within the half-bridge module. Method3400 can include mounting the current assembly onto a weld fixture or asolder fixture (ACT 3470). The weld fixture or solder fixture can holdthe current assembly in place during the manufacturing process.

Method 3400 can include rotating, moving, or otherwise positioning thecurrent assembly such that the current assembly is high side up (ACT3475). For example, the current assembly can be rotated using the solderfixture to position a high side of the current assembly in an accessibleposition. Method 3400 can include resistive welding the high side of thecurrent assembly (ACT 3480). The high side of the current assembly canbe resistive welded to prepare the surface for coupling with othercomponents of a half-bridge inverter module, such as but not limited to,PCBs. Method 3400 can include rotating, moving, or otherwise positioningthe current assembly such that the current assembly is low side up (ACT3485). For example, the current assembly can be rotated using the solderfixture to position a low side of the current assembly in an accessibleposition. Method 3400 can include resistive welding the low side of thecurrent assembly (ACT 3490). The low side of the current assembly can beresistive welded to prepare the surface for coupling with othercomponents of a half-bridge inverter module, such as but not limited to,PCBs. Method 3400 can include removing the current assembly from theweld fixture or solder fixture (ACT 3495).

Method 3400 can include installing gate drive boards in the half-bridgemodule (ACT 3500). For example, one or more PCBs can be installed withinthe half-bridge module. The PCBs can include a control PCB, power PCB,or a temperature PCB. Method 3400 can include mounting the currentassembly onto the weld fixture or solder fixture (ACT 3505). Method 3400can include rotating, moving, or otherwise positioning the currentassembly such that the current assembly is high side down (ACT 3510).Method 3400 can include soldering the high side of the current assembly(ACT 3515). For example, the high side can be selectively soldered tocouple one or more of the PCBs within the half-bridge module. Method3400 can include rotating, moving, or otherwise positioning the currentassembly such that the current assembly is low side down (ACT 3520).Method 3400 can include soldering the low side of the current assembly(ACT 3525). For example, the low side can be selectively soldered tocouple one or more of the PCBs within the half-bridge module. Method3400 can include removing the current assembly from the weld fixture orsolder fixture (ACT 3530).

Method 3400 can include placing the current assembly on top of a geltray in an assembly jig (ACT 3535). The current assembly can be disposedwithin an inner region of the gel tray. Method 3400 can include couplingfasteners with or otherwise on the gel tray (ACT 3540). The fastenerscan couple the gel tray with the half-bridge module. For example, thefasteners can couple the gel tray with shallow regions of the cold plateof the half-bridge module. Method 3400 can include placing the currentassembly on a potting jig (ACT 3545). Method 3400 can include dispensinggel into the potting jig to form the gel tray (ACT 3550). The gel can bedispensed up to a predetermined line or portion of the gel tray. Theamount of gel and the size of the gel tray can correspond to thedimensions of the half-bridge module. Method 3400 can include removingor shelving the current assembly. For example, the current assembly canbe removed from the half-bridge module. Method 3400 can include curingthe gel of the gel tray in an environment appropriate for curing (ACT3560).

FIG. 41 provides a method 4100 for assembling and manufacturing aninverter module (which can also be referred to herein as a power stack).The inverter module can include multiple half-bridge modules, such asthe half-bridge modules described above with respect to FIGS. 1-31.Method 4100 can include placing three half-bridge modules on an assemblyjig (ACT 4105). The half-bridge motors can be arranged in a tripletconfiguration such that the positive and negative phase inputs of eachof the half-bridge modules are aligned and the phase output terminals ofeach of the half-bridge modules are aligned.

Method 4100 can include placing an insulation film (ACT 4110). Forexample, the insulation film can be placed on or coupled with one ormore portions of the half-bridge modules. Method 4100 can includecoupling thermal discharge pads with the half-bridge modules (ACT 4115).The thermal discharge pads can couple with different components of thehalf-bridge module. For example, the thermal discharge pads can couplewith a cold plate of the half-bridge module. Method 4100 can includeinstalling PCBs and fasteners on the half-bridge modules (ACT 4120). Forexample, one or more control PCBs can be coupled with the half-bridgemodules. One or more power PCBs can be coupled with the half bridgemodules. A HV PCB can be coupled with the half-bridge modules. Fastenerscan be used to couple different components to the half-bridge modules.For example, a plurality of fasteners can couple the half-bridge modulesto connection points within the inverter module.

Method 4100 can include coupling bus-bars (e.g., z bus-bars) with thehalf-bridge module (ACT 4125). Method 4100 can include coupling ACbus-bars with the half-bridge modules (ACT 4130). Method 4100 caninclude coupling DC bus-bars with the half-bridge modules (ACT 4135).The bus-bars can be arranged such that they are parallel to each other.For example, positive and negative bus-bars can be installed along thesame side or surfaces of each of the half-bridge modules and bepositioned parallel to each other. The positive bus-bar can couple withpositive inputs of the half-bridge modules. The negative bus-bar cancouple with negative inputs of the half-bridge modules. The positivebus-bar can be disposed above the negative bus-bar and parallel to thenegative bus-bar along the same side surfaces of the half-bridge moduleor the positive bus-bar can be disposed below the negative bus-bar andparallel to the negative bus-bar along the same side surfaces of thehalf-bridge module. Phase bus-bars can be disposed along an oppositeside surfaces of the half-bridge module as compared to the positive andnegative bus-bars. A phase bus-bar may be coupled with an outputterminal of each of the half-bridge modules.

Method 4100 can include installing HV-GDB harnesses on the half-bridgemodules (ACT 4140). The harnesses can electrically couple thehalf-bridge modules to power systems of a drive train unit. For example,the harnesses can convey or transmit signals between the half-bridgemodules and the power system of the drive train unit. Method 4100 caninclude installing a VIBE-POT DC bus on the half-bridge modules (ACT4145).

FIG. 42 provides a method 4200 for wiring and harnesses the invertermodule. Method 4200 can include cutting or trimming wires of theinverter module to a particular length (ACT 4205). The length of each ofthe wires can be selected based at least in part on dimensions ofdifferent components of the inverter module. Method 4200 can includetrimming insulation layers of the inverter module (ACT 4210). Theinsulation layers can be trimmed such that one or more edges of therespective insulation layers do not extend out or stick out beyond edgesof the surfaces they are disposed between. For example, the insulationlayers can be trimmed such that the edges of the insulation layers areflush with the edges of the surfaces they are disposed between. Method4200 can include installing crimps within the inverter module (ACT4215). For example, one or more surfaces or edges of the inverter modulecan be crimped, bent, or folded to form a crimped edge. The crimpededges can correspond to flanges. The flanges can couple with otherinverter modules or other surfaces within a power converter to aid incoupling the respective inverter module with the power converter. Method4200 can include inspecting the crimps (ACT 4220). The crimps can beinspected to ensure they meet engineering specifications. For example,the dimensions of the crimps can be compared to a schematic of theinverter module to determine if the crimps were produced correctly.Method 4200 can include installing crimp housings (ACT 4225). The crimphousings can be disposed around the crimps. The crimp housings can forma protective barrier around the crimps. Method 4200 can includeinspecting the wire routing within the inverter module (ACT 4230). Forexample, the wire routing can be inspected and compared to a schematicof the circuitry of the inverter module to make sure the wires withinthe inverter module are correctly positioned.

FIG. 43 provides a method 4300 for forming an inverter module. Themethod 4300 can include forming one or more half-bridge modules (ACT4305). For example, a first, second, and third half-bridge modules canbe formed. The inverter module can include one or more half-bridgemodules with each of the half-bridge modules configured to generate andprovide a single phase voltage for a drive train unit of an electricvehicle. Therefore, the inverter module can be formed having threehalf-bridge modules such to provide a three phase voltage for a drivetrain unit of an electric vehicle.

The half-bridge modules can include a capacitor, a plurality oftransistors coupled together to form a half-bridge inverter circuit. Forexample, the capacitor can couple between a positive terminal and anegative terminal of the half-bridge inverter circuit. The transistorscan include a base terminal, a collector terminal, and an emitterterminal. A first collector terminal of a first transistor couples withthe positive terminal of the half-bridge inverter circuit and a firstemitter terminal of the first transistor couples with a phase terminalof the half-bridge inverter circuit. A second emitter terminal of asecond transistor couples with the negative terminal of the half-bridgeinverter circuit and a second collector terminal of the secondtransistor couples with the phase terminal of the half-bridge invertercircuit. The first transistor and the second transistor can operate asswitches and provide a phase voltage through the phase terminal 130, forexample, to a three phase motor or motor drive unit of an electricalvehicle.

Method 4300 can include coupling the half-bridge modules together (ACT4310). The half-bridge modules can be coupled together or disposedwithin an inverter module in a triplet configuration to provide acompact size. The half-bridge modules can be positioned such that theyare side by side or have side surfaces that are positioned adjacent toeach other. For example, at least one side surface of a firsthalf-bridge module is adjacent to or next to a first side surface of asecond half-bridge module and a second side surface (e.g., opposite thefirst) of the second half-bridge module is adjacent to or next to atleast one side surface of a third half-bridge module. The invertermodule can be formed having less than three half-bridge modules or morethan three half-bridge modules.

The half-bridge modules can couple together or within an enclosureforming a housing for the inverter module using one or more mountingtabs, mounting flanges, harnesses, or fasteners. For example, thehalf-bridge modules can include mounting tabs that connect to connectionpoints within the enclosure using fasteners and the mounting flanges canconnect to receiving flanges formed on an inner surface of theenclosure. The mounting tabs and mounting flanges can provideconnections between the different half-bridge modules such that outersurfaces of the half-bridge can structurally or physically coupletogether.

Method 4300 can include aligning positive inputs of the half-bridgemodules (ACT 4315). Each of the half-bridge modules can include apositive input terminal, and an output terminal. For an inverter modulehaving three half-bridge modules, first, second, and third positiveinputs of the first, second and third half-bridge modules, respectively,can be aligned with respect to each other. For example, the positiveinputs can be formed, disposed or otherwise coupled with first sidesurfaces of each of the half-bridge modules at the same height or level.Thus, when the half-bridge modules are positioned in a tripletconfiguration, the positive inputs are aligned and positioned at thesame height or level in a straight or symmetrical arrangement.

Method 4300 can include aligning negative inputs of the half-bridgemodules (ACT 4320). For an inverter module having three half-bridgemodules, first, second, and third negative inputs of the first, secondand third half-bridge modules, respectively, can be aligned with respectto each other. For example, the negative inputs can be formed, disposedor otherwise coupled with first side surfaces of each of the half-bridgemodules at the same height or level. Thus, when the half-bridge modulesare positioned in a triplet configuration, the negative inputs arealigned and positioned at the same height or level in a straight orsymmetrical arrangement.

The positive and negative inputs can be formed, disposed or otherwisecoupled with first side surfaces of each of the half-bridge modules atdifferent heights or levels. For example, the positive inputs can bepositioned at a first height or first level along the first sidesurfaces of the half-bridge modules and the negative inputs can bepositioned at a second, different height or second, different levelalong the first side surfaces of the half-bridge modules. The positiveinputs may be positioned above and offset with respect to the negativeinputs or positioned below and offset with respect to the negativeinputs or

Method 4300 can include coupling a positive bus-bar with the half-bridgemodules (ACT 4325). The positive bus-bar couples with the first, second,and third positive inputs of the first second and third half-bridgeinverter modules. The positive bus-bar can be disposed along the firstside surface of the half-bridge modules in a straight or symmetricalfashion as the positive inputs are aligned with respect to each other.Therefore, the positive bus-bar can extend along the first side surfaceparallel with respect to a top or bottom surface of the half-bridgemodules. The positive bus-bar couples an input terminal of the invertermodule (e.g., DC connector) to the positive input terminals of thehalf-bridge modules. The positive bus-bar can provide a voltage to thepositive input terminals of the half-bridge modules.

Method 4300 can include coupling a negative bus-bar with the half-bridgemodule (ACT 4330). The negative bus-bar couples with the first, second,and third negative inputs of the first, second and third half-bridgeinverter modules such that the positive bus-bar is positioned adjacentto and parallel with the negative bus-bar. The negative bus-bar can bedisposed along the first side surface of the half-bridge modules in astraight or symmetrical fashion as the negative inputs are aligned withrespect to each other. Therefore, the negative bus-bar can extend alongthe first side surface parallel with respect to a top or bottom surfaceof the half-bridge modules. The negative bus-bar couples an inputterminal of the inverter module (e.g., DC connector) to the negativeinput terminals of the half-bridge modules. The negative bus-bar canprovide a voltage to the negative input terminals of the half-bridgemodules.

The positive and negative bus-bars can be aligned with respect to eachother. For example, the positive bus-bar can be positioned at a firstheight or first level along the first side surfaces of the half-bridgemodules and the negative bus-bar can be positioned at a second,different height or second, different level along the first sidesurfaces of the half-bridge modules. The positive bus-bar can bepositioned such that it is parallel with the negative bus-bar along thefirst side surfaces of the half-bridge modules. The positive bus-bar maybe positioned above and parallel with respect to the negative bus-bar orpositioned below and parallel with respect to the negative bus-bar.

Output terminals of the half-bridge modules can be aligned. For aninverter module having three half-bridge modules, first, second, andthird output terminals of the first, second and third half-bridgemodules, respectively, can be aligned with respect to each other. Forexample, the output terminals can be formed, disposed or otherwisecoupled with second side surfaces (e.g., different from the first sidesurfaces) of each of the half-bridge modules at the same height orlevel. Thus, when the half-bridge modules are positioned in a tripletconfiguration, the output terminals are aligned and positioned at thesame height or level in a straight or symmetrical arrangement.

The output terminals can be coupled with phase bus-bars. For example, afirst phase bus-bar couples to the first output terminal of the firsthalf-bridge inverter module, a second phase bus-bar couples with thesecond output terminal of the second half-bridge inverter module, and athird phase bus-bar couples with the third output terminal of the thirdhalf-bridge inverter module. The phase terminals can provide a voltagegenerated by the half-bridge modules to a drive train unit of theelectric vehicle.

The phase bus-bars can be disposed parallel with respect to each other.The phase bus-bars can be positioned adjacent to each other or side byside and be spaced the same distance from the second surface of thehalf-bridge modules. The phase bus-bars include output terminals thatextend at the same distance above top surfaces of each of thehalf-bridge modules. For example, first, second, and third phase outputscan be formed on first, second, and third phase bus-bars, of the first,second, and third half-bridge modules respectively. The first, second,and third phase outputs can be positioned the same level or samedistance with respect to top surfaces of the first, second, and thirdhalf-bridge inverter modules.

A first voltage connector (e.g., HV connector, DC connector) can beformed or coupled with a first side surface of the enclosure housing thehalf-bridge modules. The first voltage connector can provide a voltagein a first voltage range to the half-bridge modules. For example, thefirst voltage connector can couple with the positive and negativebus-bars to provide a single phase voltage to each of the invertermodules through the respective positive inputs and negative inputs.

A second voltage connector (e.g., LV connector) can be formed or coupledwith a first side surface of the enclosure housing the half-bridgemodules. The second voltage connector can provide a voltage in a secondvoltage range (e.g., low voltage) to the half-bridge modules. The secondvoltage may be used to power different electronics within the respectivehalf-bridge modules. For example, the second voltage connector canprovide the second voltage to power the PCBs disposed within therespective half-bridge modules. The second voltage connector can couplewith the PCB through one or more PCB wires disposed within thehalf-bridge modules. The voltage connector can couple with the positiveand negative bus-bars to provide a single phase voltage to each of theinverter modules.

FIGS. 44-45 provide a method 4400 for forming a half-bridge module. Themethod 4400 can include providing a cold plate on a pick and placefixture (ACT 4405). The cold plate can include two shallow regions and ahump region. The hump region can be disposed between the two shallowregions. The cold plate can form a base for the half-bridge module. Thecold plate can include a plurality of cooling channels to provide heatdissipation or heat rejection within the half-bridge module.

Method 4400 can include disposing lubricant over a first surface of thecold plate (ACT 4410). The lubricant can be disposed over the firstsurface such that the first surface of the cold plate is coated with thelubricant. Method 4400 can include disposing a ceramic layer over thefirst surface of the cold plate (ACT 4415). The ceramic layer can bedisposed over the first surface of the cold plate that is coated withthe lubricant. The ceramic layer can operate as an electrical insulatorbetween the cold plate and other components of the half-bridge module,such as a locator.

Method 4400 can include dispensing lubricant over a first surface of theceramic layer (ACT 4420). The lubricant can be disposed over the firstsurface of the ceramic layer such that the first surface of the ceramiclayer is coated with the lubricant. Method 4400 can include installing alocator over the first surface of the ceramic layer (ACT 4425). Thelocator can be installed or disposed over the first surface of theceramic layer coated with lubricant. The locator can be coupled with thecold plate and the ceramic layer using one or more fasteners or one ormore clips.

Method 4400 can include coupling a plurality of transistors within aplurality of slots formed in the locator (ACT 4430). For example, eachof the transistors can be coupled with or disposed in at least one ofthe slots formed in the locator. The slots can be arranged such that thetransistors are organized in rows of multiple transistors. Thetransistors can couple with the locator using a plurality of clips andfasteners. The clips can include at least two gull wings that extendover and contact a top surface of the transistors. The gull wings cancompress the transistors towards the cold plate. The fasteners can beused to couple the clips to the locator. The locator and the cold platemay include one or more threaded holes to receive a threaded fastener.For example, a fastener can extend through a hole formed in a clip andinsert into a threaded hole formed in the locator and the cold plate tosecure the clip to the locator and the cold plate. Thus, the clips andfasteners can couple the locator and the ceramic layer (disposed betweenthe locator and the cold plate) to the cold plate.

Method 4400 can include providing or disposing a capacitor over a firstsurface of the plurality of transistors (ACT 4435). The capacitor caninclude a capacitor frame. The capacitor can be disposed over a firstsurface (e.g., top surface) of the transistors. The capacitor caninclude leads that couple with one or more PCBs disposed within thehalf-bridge module. Method 4400 can include disposing a gel tray overthe capacitor (ACT 4440). The gel tray can include an inner region thatcovers, houses or submerges the electronics of the half-bridge module.For example, the hump region of the cold plate can have a predeterminedheight such that it raises the capacitor and the plurality oftransistors into the inner region formed by the gel tray. Thus, the geltray can cover or surround multiple surfaces of the capacitor andtransistors.

The method 4400 can include forming an inlet coolant manifold on formingan inlet coolant manifold on a first side surface of the half-bridgemodule and forming an outlet coolant manifold on a second, differentside surface of the half-bridge module. The method 4400 can furtherinclude forming a plurality of coolant channels within the cold plate.The plurality of coolant channels can be fluidly coupled with the inletcoolant manifold and the outlet manifold. For example, the inlet coolantmanifold and the outlet coolant manifold can be fluidly coupled suchthat coolant fluid provided to the inlet coolant manifold can flowthrough the plurality of cooling channels of the cold plate to providecooling to the components (e.g., capacitor, transistor) of thehalf-bridge modules and exit the half-bridge module through the outletcoolant manifold.

The method 4400 can include coupling a first thermal pad coupled with afirst slot of the locator at a first end of the locator. The firstthermal pad can be positioned adjacent to or next to the positive inputterminal and the negative input terminal of the half-bridge module. Forexample, the first thermal pad can be in contact with the negative inputterminal and a predetermined distance from the positive input terminal.The first thermal pad configured to provide active cooling (e.g., heatrejection, heat dissipation) to the positive input terminal and thenegative input terminal.

A second thermal pad coupled with a second slot of the locator at asecond, different end of the locator. The second thermal pad can bepositioned adjacent to or next to the output terminal of the half-bridgemodule. For example, the second thermal pad can be in contact with theoutput terminal or a predetermined distance from the output terminal.The second thermal pad configured to provide active cooling (e.g., heatrejection, heat dissipation) to the output terminal.

FIG. 46 depicts an example cross-section view 4600 of an electricvehicle 4605 installed with a battery pack 4610. The battery pack 4610can correspond to a drive train unit 4610 of the electric vehicle 4605.For example, the battery pack 4610 can be disposed within or be acomponent of a drive train unit 4610. The drive train unit 4610 (and thebattery pack 4610) can provide power to the electric vehicle 4605. Forexample, the drive train unit 4610 may include components of theelectric vehicle 4605 that generate or provide power to drive the wheelsor move the electric vehicle 4605. The drive train unit 4610 can be acomponent of an electric vehicle drive system. The electric vehicledrive system can transmit or provide power to different components ofthe electric vehicle 4605. For example, the electric vehicle drive trainsystem can transmit power from the battery pack 4610 or drive train unit4610 to an axle or wheels of the electric vehicle 4605.

The electric vehicle 4605 can include an autonomous, semi-autonomous, ornon-autonomous human operated vehicle. The electric vehicle 4605 caninclude a hybrid vehicle that operates from on-board electric sourcesand from gasoline or other power sources. The electric vehicle 4605 caninclude automobiles, cars, trucks, passenger vehicles, industrialvehicles, motorcycles, and other transport vehicles. The electricvehicle 4605 can include a chassis 4615 (sometimes referred to herein asa frame, internal frame, or support structure). The chassis 4615 cansupport various components of the electric vehicle 4605. The chassis4615 can span a front portion 4620 (sometimes referred to herein a hoodor bonnet portion), a body portion 4625, and a rear portion 4630(sometimes referred to herein as a trunk portion) of the electricvehicle 2005. The front portion 4620 can include the portion of theelectric vehicle 4605 from the front bumper to the front wheel well ofthe electric vehicle 4605. The body portion 4625 can include the portionof the electric vehicle 4605 from the front wheel well to the back wheelwell of the electric vehicle 4605. The rear portion 4630 can include theportion of the electric vehicle 4605 from the back wheel well to theback bumper of the electric vehicle 4605.

The battery pack 4610 can be installed or placed within the electricvehicle 4605. The battery pack 4610 can include or couple with a powerconverter component. Power converter component can include an invertermodule 300 having three half-bridge modules 305. The battery pack 4610can be installed on the chassis 4615 of the electric vehicle 4605 withinthe front portion 4620, the body portion 4625 (as depicted in FIG. 46),or the rear portion 4630. The battery pack 4610 can couple with a firstbus-bar 4635 and a second bus-bar 4640 that are connected or otherwiseelectrically coupled with other electrical components of the electricvehicle 4605 to provide electrical power from the battery pack 4610.

FIG. 47 provides a method 4700 for forming a half-bridge module. Themethod 4700 can include providing a cold plate (ACT 4705). The coldplate can form a base for a half-bridge module. The half-bridge modulecan include the cold plate to provide active cooling to one or moreelectronic components within the half-bridge module. For example, thecold plate can be positioned within a half-bridge module such that it isnext to or adjacent to electronics such as transistors, capacitors, orPCB's. The cold plate can provide heat dissipation or heat rejectionwith the half-bridge module.

Method 4700 can include forming regions of the cold plate (ACT 4710).The cold plate can include different regions having different dimensions(e.g., height, thickness) to provide the active cooling to electroniccomponents within the half-bridge module. For example, the cold platecan be formed having a first, second, and third region with the secondregion disposed between the first and third region. The first region andthe third region can be formed having the same height. The second regioncan be formed having a greater height that the first and third regions.The second region can be referred to as a hump region. The first andthird regions can be referred to as shallow regions. The second regioncan be formed such that it is adjacent to or under the one or moreelectronic components within the half-bridge module. Thus, the secondregion (or hump region) can have a greater height to raise or push theelectronic components into an inner area or inner region formed by a geltray coupled with the cold plate. By raising the electronic componentsinto the inner region of the gel tray, the electronic components can besurround by cooling surfaces on multiple surfaces.

Method 4700 can include forming cooling channels (ACT 4715). The coldplate can include a plurality of cooling channels to provide heatdissipation or heat rejection within the half-bridge module. The coolingchannels can be formed in the second region or middle region of the coldplate. The cooling channels can be formed or positioned such that theyare adjacent to or under the one or more electronic components withinthe half-bridge module. The cooling channels can form a passageway orconduit for coolant or fluids to flow through the cold plate and provideactive cooling to electronic components disposed around the cold plate.For example, the cooling channels can be fluidly coupled with each othersuch that coolant provided to at least one cooling channel flows througheach of the cooling channels. The cooling channels may be grouped suchthat coolant only flows through particular cooling channels of theplurality of cooling channels. For example, the coolant channels can beformed into zones within the cold plate with each zone having two ormore cooling channels. Thus, different levels or amounts of coolant canbe provided the different zones of the cold plate. The cooling channelscan be formed having a circular shape, square shape or rectangularshape. Each of the cooling channels can have the same shape anddimensions or one or more of the cooling channels can have a differentshape or dimensions from one or more other cooling channels.

Method 4700 can include coupling a coolant input with the cold plate(ACT 4720). The coolant input can be formed through at least one surfaceof the cold plate. The coolant input can be fluidly coupled with atleast one cooling channel to provide coolant or other types of fluid tothe cooling channel. The coolant input can be fluidly coupled withmultiple cooling channels to provide coolant or other types of fluid tothe different cooling channel. The cold plate may include a singlecoolant input. The cold plate may include multiple coolant inputs. Forexample, different coolant inputs can be fluidly coupled with differentzones of cooling channels or different subsets of the plurality ofcooling channels to provide coolant or other types of fluid to therespective cooling channel. The coolant input can be fluidly coupledwith a coolant input manifold to receive coolant and provide the coolantto the cooling channels. The coolant input manifold can be formed on orcoupled with a second surface (e.g., bottom surface) of the cold plate.The coolant input manifold can receive coolant fluid and provide thecoolant fluid to the coolant input.

Method 4700 can include coupling a coolant output with the cold plate(ACT 4725) The coolant output can be formed through at least one surfaceof the cold plate. The coolant output can be fluidly coupled with atleast one cooling channel to form an exit or release for coolant orother types of fluid disposed within the respective cooling channel. Thecoolant output can be fluidly coupled with multiple cooling channels toform an exit or release for coolant or other types of fluid disposedwithin the respective cooling channels. The cold plate may include asingle coolant output. The cold plate may include multiple coolantoutputs. For example, different coolant outputs can be fluidly coupledwith different zones of cooling channels or different subsets of theplurality of cooling channels to form an exit or release for coolant orother types of fluid disposed within the respective cooling channels.

The coolant output can be fluidly coupled with a coolant output manifoldto release fluid from the cooling channels. For example, the coolantoutput manifold can be formed on or coupled with a second surface (e.g.,bottom surface) of the cold plate. The coolant output manifold canprovide an exit for coolant fluid flowing through the cooling channelsof the cold plate.

FIG. 48 provides a method 4800 for providing an inverter module. Themethod 4800 can include providing an inverter module (ACT 4805). Theinverter module can include first, second and third half-bridge invertermodules coupled with each other in a triplet configuration. The first,second, and third positive inputs of the first, second and thirdhalf-bridge inverter modules, respectively, can be aligned with eachother. The first, second, and third negative inputs of the first, secondand third half-bridge inverter modules, respectively, can be alignedwith respect to each other. The first, second, and third outputterminals of the first, second and third half-bridge inverter modules,respectively, can be aligned with respect to each other. The invertermodule can include a positive bus-bar coupled with the first, second,and third positive inputs of the first second and third half-bridgeinverter module. The inverter module can include a negative bus-barcoupled with the first, second, and third negative inputs of the first,second and third half-bridge inverter modules. The positive bus-bar canbe positioned adjacent to and parallel with the negative bus-bar.

FIG. 49 provides a method 4900 for providing a half-bridge module. Themethod 4900 can include providing a half-bridge module (ACT 4905). Thehalf-bridge module can include a cold plate, a ceramic layer disposedover a first surface of the cold plate, and a plurality of transistorsdisposed within slots of a locator. The locator and the plurality oftransistors can be disposed over a first surface of the ceramic layer.The half-bridge module can include a plurality of clips having gullwings that extend over the transistors to secure the plurality oftransistors to the locator, a first plurality of fasteners disposedthrough the locator and cold plate to secure the plurality of clips tothe locator, and a first printed circuit board (PCB) disposed betweenthe plurality of clips and the locator. The half-bridge module caninclude a capacitor disposed over a first surface of the plurality ofthe transistors, and a gel tray disposed over the capacitor, the firstPCB and the plurality of transistors.

The half-bridge module can include a cold plate having a first surfaceand a second, opposing surface. The cold plate can include a firstregion having a first height, a second region having the first height,and a third region having a third height. The second height can begreater than the first height. The cold plate can include a plurality ofcooling channels formed within the second region. One or more of theplurality of cooling channels can be fluidly coupled with one or moreother cooling channels. The cold plate can include a coolant inputfluidly coupled with at least one first cooling channel of the pluralityof cooling channels and a coolant output fluidly coupled with at leastone second cooling channel of the plurality of cooling channels.

Having now described some illustrative implementations, it is apparentthat the foregoing is illustrative and not limiting, having beenpresented by way of example. Features that are described herein in thecontext of separate implementations can also be implemented incombination in a single embodiment or implementation. Features that aredescribed in the context of a single implementation can also beimplemented in multiple implementations separately or in varioussub-combinations. References to implementations or elements or acts ofthe systems and methods herein referred to in the singular may alsoembrace implementations including a plurality of these elements, and anyreferences in plural to any implementation or element or act herein mayalso embrace implementations including only a single element. Referencesin the singular or plural form are not intended to limit the presentlydisclosed systems or methods, their components, acts, or elements tosingle or plural configurations. References to any act or element beingbased on any act or element may include implementations where the act orelement is based at least in part on any act or element.

References to “or” may be construed as inclusive so that any termsdescribed using “or” may indicate any of a single, more than one, andall of the described terms. References to at least one of a conjunctivelist of terms may be construed as an inclusive OR to indicate any of asingle, more than one, and all of the described terms. For example, areference to “at least one of ‘A’ and ‘B’” can include only ‘A’, only‘B’, as well as both ‘A’ and ‘B’. Such references used in conjunctionwith “comprising” or other open terminology can include additionalitems.

Where technical features in the drawings, detailed description or anyclaim are followed by reference signs, the reference signs have beenincluded for the sole purpose of increasing the intelligibility of thedrawings, detailed description, and claims. Accordingly, neither thereference signs nor their absence have any limiting effect on the scopeof any claim elements.

The systems and methods described herein may be embodied in otherspecific forms without departing from the characteristics thereof. Forexample, descriptions of positive and negative electricalcharacteristics may be reversed. For example, elements described asnegative elements can instead be configured as positive elements andelements described as positive elements can instead by configured asnegative elements. Further relative parallel, perpendicular, vertical orother positioning or orientation descriptions include variations within+/−10% or +/−10 degrees of pure vertical, parallel or perpendicularpositioning. References to “approximately,” “about” “substantially” orother terms of degree include variations of +/−10% from the givenmeasurement, unit, or range unless explicitly indicated otherwise.Coupled elements can be electrically, mechanically, or physicallycoupled with one another directly or with intervening elements. Scope ofthe systems and methods described herein is thus indicated by theappended claims, rather than the foregoing description, and changes thatcome within the meaning and range of equivalency of the claims areembraced therein.

1.-20. (canceled)
 21. A half-bridge module, comprising: a cold plate; aceramic layer disposed over a first surface of the cold plate; aplurality of transistors disposed within slots of a locator, the locatorand the plurality of transistors disposed over a first surface of theceramic layer; a plurality of clips having gull wings that extend overthe transistors to secure the plurality of transistors to the locator; afirst plurality of fasteners disposed through the locator and cold plateto secure the plurality of clips to the locator; a first printed circuitboard (PCB) disposed between the plurality of clips and the locator; acapacitor disposed over a first surface of the plurality of thetransistors; and a gel tray disposed over the capacitor, the first PCBand the plurality of transistors.
 22. The half-bridge module of claim21, comprising: each of the plurality of clips having a first gull wingportion positioned to compress a first transistor of the plurality oftransistors towards the cold plate and a second gull wing portionpositioned to compress a second transistor of the plurality oftransistors towards the cold plate.
 23. The half-bridge module of claim21, comprising: a temperature sensor coupled with at least one slot ofthe locator, the temperature coupled with the first PCB to providetemperature data corresponding to the plurality of transistors.
 24. Thehalf-bridge module of claim 21, comprising: a first thermal pad coupledwith a first slot of the locator at a first end of the locator; and asecond thermal pad coupled with a second slot of the locator at asecond, different end of the locator.
 25. (canceled)
 26. The half-bridgemodule of claim 21, comprising: second and third PCBs coupled withopposing sides of the capacitor and disposed within the gel tray. 27.The half-bridge module of claim 21, comprising: the cold plate havingtwo shallow regions and a hump region, the hump region disposed betweenthe two shallow regions, and the hump region configured to raise thecapacitor, the PCB and the plurality of transistors into the gel tray.28. The half-bridge module of claim 21, comprising: a locator having aplurality of slots, the plurality of transistors disposed within theslots of the locator, and the locator and the plurality of transistorsdisposed over a first surface of the ceramic layer.
 29. The half-bridgemodule of claim 21, comprising: a second plurality of fasteners couplingthe gel tray with the cold plate, the second plurality of fastenerspositioned to extend through the cold plate and couple with threadedholes formed in the gel tray.
 30. The half-bridge module of claim 21,comprising: a first end of the gel tray coupled with a first shallowregion of the cold plate and a second end of the gel tray coupled with asecond shallow region of the cold plate.
 31. The half-bridge module ofclaim 21, comprising: an inlet coolant manifold; an outlet coolantmanifold; and a plurality of coolant channels formed within the coldplate, the plurality of coolant channels fluidly coupled with the inletcoolant manifold and the outlet manifold, the inlet coolant manifoldconfigured to provide liquid coolant to the plurality of coolantchannels.
 32. The half-bridge module of claim 21, comprising: a thermalinterface formed between the cold plate, the ceramic layer, and theplurality of transistors configured to provide active cooling to theplurality of transistors, and the plurality of clips configured tocompress the thermal interface between the cold plate, the ceramiclayer, and the plurality of transistors.
 33. The half-bridge module ofclaim 21, comprising: the gel tray having an inner region that housesthe capacitor, the first PCB, and the plurality of transistors such thatmultiple side surfaces of the capacitor, the first PCB, and theplurality of transistors are surrounded by the gel tray.
 34. Thehalf-bridge module of claim 21, comprising: a first transistor of theplurality of transistors having a first set of leads coupled with asecond PCB and a second transistor of the plurality of transistorshaving a second set of leads coupled with a third PCB.
 35. Thehalf-bridge module of claim 21, comprising: a second PCB coupled withthe half-bridge module, the second PCB having control circuitry, and thesecond PCB configured to generate control signals for the half-bridgemodule.
 36. The half-bridge module of claim 21, comprising: atemperature sensor disposed adjacent to an coolant outlet manifold ofthe half-bridge module, the temperature sensor configured to generatetemperate data corresponding to liquid coolant provided to thehalf-bridge module; and a pressure sensor disposed within half-bridgemodule, the pressure sensor configured to generate pressure data for thehalf-bridge module.
 37. (canceled)
 38. A method, comprising: providing acold plate on a pick and place fixture, the cold plate having twoshallow regions and a hump region, and the hump region disposed betweenthe two shallow regions; dispensing a lubricant over a first surface ofthe cold plate; disposing a ceramic layer over the first surface of thecold plate; dispensing the lubricant over a first surface of the ceramiclayer; installing a locator over the first surface of the ceramic layer;coupling a plurality of transistors within a plurality of slots formedin the locator using a plurality of clips and fasteners, each of theplurality of clips including at least two gull wings that extend out andover at least one of the plurality of transistors, and the plurality offasteners coupling the plurality of clips to the locator; providing acapacitor over a first surface of the plurality of transistors; anddisposing a gel tray over the capacitor, the hump region of the coldplate is configured to raise the capacitor and the plurality oftransistors into the gel tray.
 39. The method of claim 38, comprising:forming an inlet coolant manifold on a first side surface of thehalf-bridge module; forming an outlet coolant manifold on a second,different side surface of the half-bridge module; and forming aplurality of coolant channels within the cold plate, the plurality ofcoolant channels fluidly coupled with the inlet coolant manifold and theoutlet manifold, the inlet coolant manifold configured to provide liquidcoolant to the plurality of coolant channels.
 40. A method, comprising:providing a half-bridge module, the half-bridge module comprising: acold plate; a ceramic layer disposed over a first surface of the coldplate; a plurality of transistors disposed within slots of a locator,the locator and the plurality of transistors disposed over a firstsurface of the ceramic layer; a plurality of clips having gull wingsthat extend over the transistors to secure the plurality of transistorsto the locator; a first plurality of fasteners disposed through thelocator and cold plate to secure the plurality of clips to the locator;a first printed circuit board (PCB) disposed between the plurality ofclips and the locator; a capacitor disposed over a first surface of theplurality of the transistors; and a gel tray disposed over thecapacitor, the first PCB and the plurality of transistors. 41.-63.(canceled)
 64. The method of claim 38, comprising: disposing each of theplurality of clips having a first gull wing portion positioned tocompress a first transistor of the plurality of transistors towards thecold plate and a second gull wing portion positioned to compress asecond transistor of the plurality of transistors towards the coldplate.
 65. The method of claim 38, comprising: disposing a temperaturesensor adjacent to an coolant outlet manifold of the half-bridge module,the temperature sensor configured to generate temperate datacorresponding to liquid coolant provided to the half-bridge module; anddisposing a pressure sensor disposed within half-bridge module, thepressure sensor configured to generate pressure data for the half-bridgemodule.